ASUS TUF Gaming A18 FA808UH-RS74-HID9P gaming laptop 18" 144Hz Ryzen 7 260 RTX 5050 32 GB
- Eclipse Gray
- Windows 11 Pro
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ASUS
An 18 inch 144 Hz WUXGA IPS gaming laptop with a 16 core Ryzen 7 260, RTX 5050 8 GB GDDR7, 96 GB DDR5 5600 MHz and a 1 TB PCIe 4.0 NVMe SSD
Memory 96 GB DDR5
Operating System Windows 11 Pro
The ASUS TUF Gaming A18 FA808UH-RS74-HID16P is an 18-inch laptop built around an AMD Ryzen 7 260 processor with 16 cores and a 5.1 GHz max turbo frequency. It ships with Windows 11 Pro and an NVIDIA GeForce RTX 5050 GPU, targeting users who want a large-screen portable machine for gaming and heavy multitasking. The Eclipse Gray chassis measures 15.71 by 11.14 by 0.74 inches and weighs 5.73 lbs.
Memory is upgraded to 96 GB of DDR5 5600 MHz in a dual-channel 2 x 48 GB configuration, giving ample headroom for memory-hungry applications and concurrent workloads. The 1 TB M.2 PCIe 4.0 x4 NVMe SSD provides fast boot and load times for games and large files. The RTX 5050 carries 8 GB of GDDR7 video memory, which supports modern titles at the panel's native 1920 x 1200 resolution, though the 144 Hz IPS-level display may become the limiting factor in competitive shooters.
HIDevolution applies Gelid GC Extreme thermal interface material to both the CPU and GPU, lowering peak temperatures under sustained load compared with the stock paste. The build also includes a full quality-control cycle: updated BIOS and drivers, burn-in stress testing, benchmark verification, keyboard, touchpad, port and display checks, and a physical chassis inspection. These steps reduce the chance of a defect on arrival and ensure the system ships in a stable, validated state.
| Brand | ASUS |
|---|---|
| Series | TUF Gaming A18 |
| Model | FA808UH-RS74 |
| Part Number | FA808UH-RS74-HID16P |
| Color | Eclipse Gray |
| Operating System | Windows 11 Pro |
| CPU | AMD Ryzen™ 7 260 |
| Screen | 18" WUXGA |
| Memory | 96GB |
| Storage | 1 TB M.2 PCIe 4.0 x4 NVMe SSD |
| Graphics Card | NVIDIA® GeForce® RTX™ 5050 |
| Video Memory | 8GB |
| Dimensions (W x D x H) | 15.71" x 11.14" x 0.74" ~ 1.05" |
| Weight | 5.73 lbs |
| CPU Type | AMD Ryzen 200 Series |
| Processor Name | AMD Ryzen 7 260 |
| Number of Cores | 16-core Processor |
| Turbo Frequency | Max Turbo Frequency 5.1 GHz |
| CPU L3 Cache | 16 MB |
| Screen Size | 18.0" |
| Touchscreen | Non-Touch Screen |
| Display Type | FHD+ |
| Resolution | 1900 x 1200 |
| Panel | FHD+ |
| Refresh Rate | 144Hz |
| Color Gamut | sRGB:100% |
| Display Features | FHD+ 144Hz IPS-Level |
| GPU/VPU | GeForce RTX 5050 Laptop GPU |
| Graphic Type | Dedicated Card |
| SSD | 1TB |
| HDD | No |
| Storage Spec | 1 TB M.2 PCIe 4.0 x4 NVMe SSD |
| Memory Speed | DDR5 5600MHz |
| Memory Spec | 2 x 48 GB |
| Memory Slot (Total) | 2 |
| Memory Slot (Available) | 0 |
| Max Memory Supported | 128GB |
| WLAN | Wi-Fi 6E(802.11ax) (Triple band) 2*2 |
| WiFi Generation | Wi-Fi 6E |
| Bluetooth | Bluetooth® 5.3 |
| USB | 1x USB 2.0 Type-A, 2x USB 3.2 Gen 2 Type-A, 1x USB 3.2 Gen 2 Type-C with support for DisplayPort™ / power delivery / G-SYNC, 1x Type-C USB 4 with support for DisplayPort™ |
| HDMI | 1x HDMI 2.1 FRL |
| Audio Ports | 3.5mm Combo Audio Jack |
| Audio | Dolby Atmos, AI noise-canceling technology, Hi-Res certification (for headphone) |
| Speaker | 2-speaker system |
| Touchpad | Yes |
| Keyboard | Backlit Chiclet Keyboard 1-Zone RGB |
| Backlit Keyboard | Backlit |
| Webcam | 1080P FHD IR Camera |
| Card Reader | None |
| Style | Thin and Light |
| Type | Gaming & Entertainment |
| Usage | Consumer |
| AC Adapter/Charger | Rectangle Conn, 240W AC Adapter, Output: 20V DC, 12A, 240W, Input: 100~240C AC 50/60Hz universal |
| Battery | 90WHrs, 4S1P, 4-cell Li-ion |
Versi lain model ini
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The chassis measures 15.71 inches wide by 11.14 inches deep and stands 0.74 to 1.05 inches high, weighing 5.73 lbs.
The system ships with 96 GB in a dual channel 2 x 48 GB configuration running at 5600MHz, leaving no empty slots for further expansion.
The laptop includes Gelid GC Extreme thermal interface material on the CPU and GPU applied during the build process for lower operating temperatures.
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