STARTECH ADJDINKIT 2U Adjustable DIN Rail Kit 19in server accessory
- Rail Kit
- U Height: 2U Frame…
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GIGABYTE
A 5U rackmount barebone server for AI, ML and HPC workloads, supporting dual 4th Gen Intel Xeon processors, 32 DDR5 4800 memory slots and eight NVIDIA HGX H100 SXM5 GPUs with 900GB/s interconnection
The GIGABYTE G593-SD0-AAX1 is a 5U rackmount barebone server built around the NVIDIA HGX H100 platform with eight SXM5 GPUs. It supports dual 4th Gen Intel Xeon Scalable processors in LGA 4677 sockets with a TDP ceiling of 350 W each. The Intel C741 north bridge provides eight memory channels per processor across 32 DDR5 4800 DIMM slots.
This platform targets organisations deploying large-scale AI training, inference or high-performance computing workloads that can exploit the 900 GB/s GPU-to-GPU interconnect via NVLink and NVSwitch. It is not suited for buyers who need a general-purpose server with installed CPUs, memory or storage, or for teams that lack the infrastructure to power and cool an 8-GPU HGX system.
The defining specification is the NVIDIA HGX H100 baseboard with eight SXM5 GPUs linked by NVLink and NVSwitch at up to 900 GB/s. This GPU fabric decides whether the chassis matches the workload; all other components scale around that fixed configuration.
| Brand | GIGABYTE |
|---|---|
| Model | G593-SD0 |
| Form Factor | 5U Rackmount |
| Workload | AI/ML/HPC |
| CPU Type | Intel Xeon |
| CPU Socket | LGA 4677 |
| Installed CPU | No CPU Installed |
| Max Processors | 2 |
| CPU Features | Dual processor, CPU TDP up to 350W |
| North Bridge | Intel C741 |
| Memory Slots | 32 x 288Pin |
| Installed Memory Size | No Memory Installed |
| Max Memory Supported | RDIMM modules up to 96GB supported 3DS RDIMM modules up to 256GB supported |
| Memory Type Supported | DDR5 4800 |
| Channel Supported | 8 Channel |
| Installed HDD | No Storage Installed |
| GPU/VPU | NVIDIA HGX H100 with 8 x SXM5 GPUs |
| PCI Express | 8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104 2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0 2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0 |
| First LAN | Intel X710-AT2 |
| Max. LAN Speed | 10 Gigabit |
| Hot-Swap Bays | 8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays, from PEX89104 |
| Front USB | 2 x USB 3.2 Gen1 |
| RJ45 | 2 |
| Other Ports | 1 x TPM header 1 x VROC connector 1 x Front panel header |
| Max. Power | 4+2 3000W (240V) 80 PLUS Titanium redundant power supplies |
| Temperature | Operating temperature: 10°C to 35°C Non-operating temperature: -40°C to 60°C |
| Humidity | Operating humidity: 8%-80% (non-condensing) Non-operating humidity: 20%-95% (non-condensing) |
| Berat penghantaran | 30.00 kg |
| Dimensi bungkusan | 940 × 447 × 222 mm |
The barebone ships with no CPUs, no DDR5 memory and no storage installed. You must supply up to two LGA 4677 Xeon processors, up to 32 DDR5 4800 RDIMM or 3DS RDIMM modules, and drives for the eight 2.5-inch NVMe/SATA/SAS hot-swap bays.
Choose 96 GB RDIMM modules for standard density or 256 GB 3DS RDIMM modules for maximum capacity; both run at DDR5 4800 across the 8-channel per processor architecture.
The 900 GB/s NVLink and NVSwitch fabric lets all eight H100 GPUs exchange model data directly at full bandwidth, reducing multi-GPU scaling overhead for large-language-model and HPC training.
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