EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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Intel
12-core server CPU with 24 threads running at 2.6 GHz base and 3.70 GHz turbo, 19.25 MB L3 cache, DDR4-2666 support across six channels, and 125 W TDP
The Intel Xeon Gold 6126 is a 12-core processor built on 14 nm SkyLake architecture for data-centre workloads. It delivers 24 threads at a 2.6 GHz base frequency with a 3.70 GHz max turbo boost. The 19.25 MB L3 cache and integrated six-channel memory controller supporting DDR4 up to 2666 MHz target virtualised and storage-heavy applications.
This CPU requires an FCLGA3647 socket and a server-class chipset with six populated memory channels to reach rated bandwidth. The 125 W TDP demands adequate cooling and power delivery designed for sustained multi-core loads. Hyper-Threading and hardware virtualisation support let a single socket handle dense VM or container deployments without extra compute nodes.
The processor ships as a tray unit without a stock cooler, freeing budget for a purpose-built heatsink or liquid loop matched to the 125 W envelope. Intel virtualisation extensions and AES-NI are enabled out of the box, reducing software licensing overhead for encryption-heavy workloads. No bundled software or accessories are included beyond the processor itself.
| Brand | Intel |
|---|---|
| Series | Xeon |
| Name | Intel Xeon Gold 6126 Processor |
| Model | CD8067303405900 |
| CPU Socket Type | FCLGA3647 |
| Core Name | SkyLake |
| # of Cores | 12-Core |
| # of Threads | 24 |
| Operating Frequency | 2.6 GHz |
| Max Turbo Frequency | 3.70 GHz |
| L3 Cache | 19.25 MB |
| Manufacturing Tech | 14 nm |
| 64-Bit Support | Yes |
| Hyper-Threading Support | Yes |
| Integrated Memory Controller Speed | 2666 MHz |
| Memory Channel | 6 |
| Virtualization Technology Support | Yes |
| Thermal Design Power | 125W |
| Berat penghantaran | 0.14 kg |
| Dimensi bungkusan | 152 × 152 × 51 mm |
The processor has a 125 W thermal design power, which is the ceiling the cooling solution must dissipate during continuous full-load operation across all 12 cores.
At the 125 W TDP the chip will generate significant heat; a server-grade heatsink or liquid cooler rated for at least 125 W is required to keep temperatures stable and fan noise manageable.
You need an FCLGA3647 socket motherboard and a six-channel DDR4-2666 registered ECC memory kit to match the integrated memory controller specification.
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