OWC 16GB DDR4 2666MHz PC4-21300 CL19 1.2V 288pin ECC Registered RDIMM for Lenovo ThinkAgile Xeon SP Gen 1
- 16GB
- 288-Pin DDR4 ECC RD…
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OWC
16 GB DDR4-2666 ECC registered DIMM for Lenovo ThinkSystem SR670, SR850, SR860, SR950 and ST550 servers
This 16 GB DDR4 2666 MHz ECC registered DIMM is built for Lenovo ThinkSystem servers including the SR670, SR850, SR860, SR950 and ST550. It targets administrators who need to expand capacity or replace failed modules in Xeon SP Gen 1 platforms. The module will not work in standard desktop computers and cannot be mixed with unbuffered memory.
Operating at 1.2 V with CL19 latency, the module runs at standard DDR4 voltage without a heat spreader. Registered buffering reduces electrical load on the memory controller, helping keep power draw predictable in multi-DIMM configurations. No active cooling is required beyond normal server airflow.
The DIMM replaces Lenovo part numbers 01AG618, 4X70P98202 and 7X77A01303 and is backward compatible with 2133 MHz and 2400 MHz slots. The upgrade is worthwhile when adding capacity to existing channels or swapping out slower modules in the supported ThinkSystem models. Buyers who need unbuffered memory or desktop compatibility should look elsewhere.
| Brand | OWC |
|---|---|
| Part Number | 2R6D42R816GB |
| Capacity | 16GB |
| Type | 288-Pin DDR4 ECC RDIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.2V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx8 |
| Heat Spreader | No |
| Compatible System | Lenovo ThinkSystem (Xeon SP Gen 1) SR670 Lenovo ThinkSystem (Xeon SP Gen 1) SR850 Lenovo ThinkSystem (Xeon SP Gen 1) SR860 Lenovo ThinkSystem (Xeon SP Gen 1) SR950 Lenovo ThinkSystem (Xeon SP Gen 1) ST550 |
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Power down the server, open the chassis, align the module notch with the slot key, press firmly until the ejector tabs click, then verify in BIOS that the 2666MHz speed and ECC are recognised; the step often missed is confirming the registered DIMM is seated in a supported slot population order for the Xeon SP Gen 1 platform.
No routine maintenance is required; if a module fails, replace it with an identical 16GB DDR4 2666MHz ECC registered 2Rx8 part to keep rank balance and error-correction consistency across the memory channels.
The thermal envelope of the unbuffered PCB without a heat spreader typically becomes the limiting factor before the 2666MHz data rate or CL19 latency thresholds are reached.
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