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Green Mini ITX server motherboard with LGA 1700 socket, two SODIMM slots, PCIe x16 slot, dual M.2 slots, HDMI, DisplayPort, LVDS

Supermicro

Supermicro MBD-X13SAV-LVDS-O LGA 1700 Mini ITX server motherboard

SKU CH-PMV7-FYY06 MPN MBD-X13SAV-LVDS-O

Mini ITX server board with LGA 1700 socket, Intel Q670E chipset, DDR4 3200 support up to 64 GB, PCIe 5.0 x16, dual LAN and LVDS output

  • CPU Socket TypeLGA 1700
  • CPU TypeSupports 12th Generation Intel Core i9 / Core i7 / Core i5 /
  • Number of Processor Support1
  • North BridgeIntel Q670E
  • Number of DDR4 Slots2 x 260-pin
  • DDR4 StandardDDR4 3200
  • Supports 12th Gen Intel Core up to 65W TDP on LGA 1700 socket
  • Intel Q670E chipset provides two SODIMM slots for up to 64GB DDR4-3200
  • PCI-E 5.0 x16 slot and M.2 M-Key 2280 at PCI-E 4.0 x4 for fast expansion
  • Dual Intel LAN with 1GbE and 2.5GbE including AMT/vPro support
  • Mini ITX 6.7" board offers HDMI 2.0b, dual DisplayPort, LVDS and four rear USB 3.2 Gen2 ports

Server board for embedded builds

The Supermicro MBD-X13SAV-LVDS-O is a Mini ITX server motherboard that fits the LGA 1700 socket and the Intel Q670E chipset. It accepts one 12th Generation Intel Core i9, i7, i5, i3, Pentium or Celeron processor with a thermal design power up to 65W. Two 260-pin SODIMM slots support unbuffered non-ECC DDR4-3200 memory up to 64GB. The compact 6.7" x 6.7" form factor targets embedded and edge deployments where space is limited.

Thermals and power in a 65W envelope

With a single CPU capped at 65W TDP the board runs well within the thermal limits of small chassis and passively cooled enclosures. The Mini ITX layout keeps trace lengths short, reducing voltage-drop losses on the power phases. One PCI Express 5.0 x16 slot and two M.2 connectors add expansion without increasing the power budget. Fan headers are available for active cooling if the enclosure demands it.

LVDS and dual LAN change the deployment

An onboard LVDS header drives flat-panel displays directly, removing the need for an external converter in kiosk or industrial panels. Dual Ethernet — one 1 Gigabit port with the Intel i210-AT controller and one 2.5 Gigabit port with the Intel i225LM controller supporting AMT and vPro — provides managed out-of-band access and higher throughput on a single cable. Five SATA 6.0Gb/s ports and the M.2 M-Key 2280 slot handle local storage, while the E-Key 2230 slot accepts CNVi or PCIe 3.0 x1 wireless modules.

Ciri-ciri utama

  • Supports 12th Gen Intel Core up to 65W TDP on LGA 1700 socket
  • Intel Q670E chipset provides two SODIMM slots for up to 64GB DDR4-3200
  • PCI-E 5.0 x16 slot and M.2 M-Key 2280 at PCI-E 4.0 x4 for fast expansion
  • Dual Intel LAN with 1GbE and 2.5GbE including AMT/vPro support
  • Mini ITX 6.7" board offers HDMI 2.0b, dual DisplayPort, LVDS and four rear USB 3.2 Gen2 ports

Spesifikasi

BrandSUPERMICRO
ModelMBD-X13SAV-LVDS-O
CPU Socket TypeLGA 1700
CPU TypeSupports 12th Generation Intel Core i9 / Core i7 / Core i5 / Core i3 / Pentium / Celeron Processor
Number of Processor Support1
North BridgeIntel Q670E
Number of DDR4 Slots2 x 260-pin
DDR4 StandardDDR4 3200
PCI Express 5.0 x161 PCI-E 5.0 x16
SATA5 x SATA 6.0Gb/s
M.2M.2 Interface: 1 PCI-E 4.0 x4; 1 CNVi/PCI-E 3.0 x1
Form Factor: 2280, 2230
Key: M-Key, E-Key
Back I/O Ports2 USB 2 port(s) (2 via header)
4 USB 3.2 Gen2 port(s) (4 rear type A)
2 USB 3.1 Gen1 port(s) (2 via header)
1 HDMI 2.0b port(s)
2 DP (DisplayPort) port(s)
1 HDMI port(s)
1 LVDS port(s)
Form FactorMini ITX
Dimensions (W x L)6.7" x 6.7"
Berat penghantaran0.77 kg
Dimensi bungkusan283 × 271 × 55 mm

Soalan tentang produk ini

How do I install a CPU into the LGA 1700 socket without bending pins?

Align the processor triangle with the socket marker, lower it straight down without pressure, then close the independent load mechanism lever until it clicks; the 65W TDP limit means no extra cooler clearance steps are needed.

What memory upgrades will this board need later and how much can it take?

Two 260-pin DDR4 3200 SODIMM slots support up to 64GB total; add matching unbuffered non-ECC modules in pairs for dual-channel operation.

Which thermal limit appears first when the PCI-E 5.0 x16 slot runs sustained loads?

The CPU 65W TDP ceiling is reached before the chipset or VRM throttles, so a cooler rated for at least 65W continuous dissipation is the practical limit.

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