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ATX motherboard with dark heatsinks and back-panel connectors

ASUS

ASUS TUF GAMING Z790-BTF WIFI Intel Z790 LGA1700 ATX DDR5 PCIe 5.0 WiFi7 2.5GbE motherboard

SKU CH-SP4T-Q94H1

ATX Intel Z790 board with LGA 1700 socket, back-panel connector design for cleaner builds, 16+1+1 phase 60 A power delivery, four DDR5 slots up to 7200 MT/s, PCIe 5.0 x16 slot.

  • CPU Socket TypeLGA 1700

model TUF GAMING Z790-BTF WIFI

  • Back-panel connectors simplify cable routing for cleaner builds
  • 16+1+1 phase VRM with 60A DrMOS delivers stable power under load
  • Four DDR5 slots reach 7200+ MT/s via OptiMem II tuning
  • PCIe 5.0 x16 SafeSlot plus four PCIe 4.0 M.2 slots with heatsinks
  • Q-Release button and M.2 Q-Latch make component swaps tool-free

Back-panel connector design

This ATX motherboard uses the Intel LGA 1700 socket and Z790 chipset to support 12th-14th Gen Intel Core CPUs. Its BTF layout moves power and data connectors to the rear of the board for cleaner cable routing. A compatible BTF case and graphics card are required to use the back-panel design.

Four PCIe 4.0 M.2 slots with heatsinks

The board provides four M.2 slots wired for PCIe 4.0 speeds, each fitted with a heatsink to manage drive temperatures. A Q-Latch mechanism secures drives without screws, and the Q-Release button eases graphics card removal. Three Gen2 ARGB headers with Aura Sync handle lighting control.

DDR5 memory and 8+8-pin CPU power

Four DDR5 DIMM slots support speeds up to 7200 MT/s (OC) through OptiMem II topology. The 16+1+1 phase VRM uses 60 A DrMOS stages and needs two 8-pin ProCool connectors for full CPU power delivery. Verify that your case, GPU and power supply match the BTF connector layout before ordering.

Öne çıkanlar

  • Back-panel connectors simplify cable routing for cleaner builds
  • 16+1+1 phase VRM with 60A DrMOS delivers stable power under load
  • Four DDR5 slots reach 7200+ MT/s via OptiMem II tuning
  • PCIe 5.0 x16 SafeSlot plus four PCIe 4.0 M.2 slots with heatsinks
  • Q-Release button and M.2 Q-Latch make component swaps tool-free

Teknik özellikler

CPU Socket TypeLGA 1700

Bu modelin diğer sürümleri

Aynı seriden 4 tane daha

Aynı aile, farklı bellek, soğutucu veya frekans — karar vermeden önce karşılaştırın.

Bu ürünle ilgili sorular

Will the back-panel BTF connectors need a new case or GPU later?

The BTF design requires a compatible BTF case and GPU, so any future chassis or graphics card upgrade must also support the back-panel connector standard.

What limits the 16+1+1 phase VRM during extended heavy loads?

The 60 A DrMOS stages and massive heatsinks set the thermal ceiling; sustained all-core workloads will hit VRM temperature limits before the power phases saturate.

How loud or hot does the board get when running all day?

Large VRM heatsinks and M.2 heatsinks passively dissipate heat, so fan noise stays low and component temperatures remain controlled during continuous operation.

Bu reyondan diğerleri

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