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Favori ürünler Giriş yap
Black M.2 2280 NVMe SSD with silver heatsink

Silicon Power

Silicon Power XS70 1TB M.2 2280 NVMe internal SSD SP01KGBP44XS7005

SKU CH-H3GW-T6A7Q MPN SP01KGBP44XS7005

1TB M.2 2280 internal SSD with PCIe 4.0 x4 interface, read speeds up to 7300 MBps, write speeds up to 6000 MBps, and an integrated heatsink for PlayStation 5 expansion

  • Device TypeInternal Solid State Drive (SSD)
  • Used ForConsumer
  • Form FactorM.2 2280
  • Capacity1TB
  • Memory Components3D NAND
  • InterfacePCI-Express 4.0 x4, NVMe 1.4

Options 1TB

  • PlayStation 5 storage expansion with 1TB capacity
  • Sequential read up to 7300 MB/s for fast game loads
  • Sequential write up to 6000 MB/s for quick installs
  • Built-in heatsink keeps drive cool during long sessions
  • 6 million hour MTBF for long-term reliability

PlayStation 5 compatible NVMe drive

The Silicon Power XS70 is a 1TB M.2 2280 NVMe internal SSD built for consumers who need fast storage in a compact form factor. It uses a PCI-Express 4.0 x4 interface with NVMe 1.4 support for high sequential speeds and low latency. The drive is validated for PlayStation 5 storage expansion, letting console owners add space without an adapter.

Integrated heatsink and DRAM cache

A unique heatsink design ships pre-attached to deliver maximum heat dissipation and thermal management during sustained workloads. The controller supports a DRAM cache buffer that improves both sequential and random read or write performance. LDPC and RAID engine technology add extra data integrity and stability across the 3D NAND array.

Compact dimensions for tight builds

The module measures 10.80mm tall, 24.60mm wide and 80.00mm deep, weighing 33.00g, so it fits laptops and small form factor PCs with limited clearance. Rated for 1,600,000 hours MTBF and 1500G shock resistance, the drive operates reliably from 0°C to 70°C. The single-sided M.2 2280 layout simplifies installation in most motherboards and the PS5 slot.

Öne çıkanlar

  • PlayStation 5 storage expansion with 1TB capacity
  • Sequential read up to 7300 MB/s for fast game loads
  • Sequential write up to 6000 MB/s for quick installs
  • Built-in heatsink keeps drive cool during long sessions
  • 6 million hour MTBF for long-term reliability

Teknik özellikler

BrandSilicon Power
ModelXS70
Part NumberSP01KGBP44XS7005
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Form FactorM.2 2280
Capacity1TB
Memory Components3D NAND
InterfacePCI-Express 4.0 x4, NVMe 1.4
Max Sequential ReadUp to 7300 MBps
Max Sequential WriteUp to 6000 MBps
MTBF1,600,000 hours
HeatSinkwith HeatSink
FeaturesPCIe Gen 4x4 interface with read speeds up to 7,300MB/s and write speeds up to 6,800MB/s
Compatible with PlayStation 5 for additional storage expansion
Unique heatsink design provides maximum heat dissipation and thermal management
NVMe 1.4 support allows for higher performance, lower latency, and lower power consumption
Available in massive storage capacity options ranging from 1TB to 4TB
Supports DRAM Cache Buffer for improved sequential read/write and random read/write performance
Supports LDPC and RAID engine technology for enhanced data integrity and stability
Small form factor
Operating Temperature0°C ~ +70°C
Max Shock Resistance1500G/0.5ms
Height10.80mm
Width24.60mm
Depth80.00mm
Weight33.00g
Kargo ağırlığı0.05 kg
Koli boyutu127 × 89 × 11 mm

Bu modelin diğer sürümleri

Aynı seriden 1 tane daha

Aynı aile, farklı bellek, soğutucu veya frekans — karar vermeden önce karşılaştırın.

Bu ürünle ilgili sorular

How often will the heatsink need cleaning or replacement?

The integrated heatsink is a passive part with no moving components, so it does not require cleaning or replacement under normal use.

What limits sustained write performance first, the NAND or the controller?

Sequential write speed is rated up to 6000 MBps, so the controller and firmware set the practical ceiling during long transfers.

How hot does the drive get and how much power does it draw during all-day use?

Operating temperature range is 0 °C to 70 °C; the heatsink keeps the drive within this envelope during continuous workloads.

Bu reyondan diğerleri

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