Silicon Power XS70 2TB internal SSD SP02KGBP44XS7005
- Internal Solid Stat…
- Consumer
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Silicon Power
1TB M.2 2280 internal SSD with PCIe 4.0 x4 interface, read speeds up to 7300 MBps, write speeds up to 6000 MBps, and an integrated heatsink for PlayStation 5 expansion
Options 1TB
The Silicon Power XS70 is a 1TB M.2 2280 NVMe internal SSD built for consumers who need fast storage in a compact form factor. It uses a PCI-Express 4.0 x4 interface with NVMe 1.4 support for high sequential speeds and low latency. The drive is validated for PlayStation 5 storage expansion, letting console owners add space without an adapter.
A unique heatsink design ships pre-attached to deliver maximum heat dissipation and thermal management during sustained workloads. The controller supports a DRAM cache buffer that improves both sequential and random read or write performance. LDPC and RAID engine technology add extra data integrity and stability across the 3D NAND array.
The module measures 10.80mm tall, 24.60mm wide and 80.00mm deep, weighing 33.00g, so it fits laptops and small form factor PCs with limited clearance. Rated for 1,600,000 hours MTBF and 1500G shock resistance, the drive operates reliably from 0°C to 70°C. The single-sided M.2 2280 layout simplifies installation in most motherboards and the PS5 slot.
| Brand | Silicon Power |
|---|---|
| Model | XS70 |
| Part Number | SP01KGBP44XS7005 |
| Device Type | Internal Solid State Drive (SSD) |
| Used For | Consumer |
| Form Factor | M.2 2280 |
| Capacity | 1TB |
| Memory Components | 3D NAND |
| Interface | PCI-Express 4.0 x4, NVMe 1.4 |
| Max Sequential Read | Up to 7300 MBps |
| Max Sequential Write | Up to 6000 MBps |
| MTBF | 1,600,000 hours |
| HeatSink | with HeatSink |
| Features | PCIe Gen 4x4 interface with read speeds up to 7,300MB/s and write speeds up to 6,800MB/s Compatible with PlayStation 5 for additional storage expansion Unique heatsink design provides maximum heat dissipation and thermal management NVMe 1.4 support allows for higher performance, lower latency, and lower power consumption Available in massive storage capacity options ranging from 1TB to 4TB Supports DRAM Cache Buffer for improved sequential read/write and random read/write performance Supports LDPC and RAID engine technology for enhanced data integrity and stability Small form factor |
| Operating Temperature | 0°C ~ +70°C |
| Max Shock Resistance | 1500G/0.5ms |
| Height | 10.80mm |
| Width | 24.60mm |
| Depth | 80.00mm |
| Weight | 33.00g |
| Berat penghantaran | 0.05 kg |
| Dimensi bungkusan | 127 × 89 × 11 mm |
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The integrated heatsink is a passive part with no moving components, so it does not require cleaning or replacement under normal use.
Sequential write speed is rated up to 6000 MBps, so the controller and firmware set the practical ceiling during long transfers.
Operating temperature range is 0 °C to 70 °C; the heatsink keeps the drive within this envelope during continuous workloads.
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