Приемаме криптовалута — така монетите, които притежавате, могат да купят истински хардуер.Платете с крипто, похарчете го за истински хардуер. Безплатна застрахована доставка по целия свят над 399 $. Неутрални кашони без марка, изпратени от Германия.Безплатна застрахована доставка над 399 $. Курсът Ви е заключен за 30 минути веднага след отварянето на касата.Курс, заключен за 30 минути. Всеки артикул е запечатан, серийният му номер е проверен, и е покрит с 24-месечна гаранция.Запечатан, 24-месечна гаранция.

Проследени артикули Вход

Arctic Silver

Arctic Silver AS-AS5-35 Silver 5 Thermal Paste 3.5g

SKU CH-W58D-QB8WX

Premium thermal compound with 99.9% pure silver and 88% filler density for CPU and heatsink interfaces

  • FeaturesWith its unique high density filling of micronized silver an
  • Maximises heat transfer with 99.9% pure silver particles
  • Over 88% thermally conductive filler by weight for high density
  • Triple-phase viscosity ensures stable application without silicone
  • 5 g tube covers multiple CPU installations
  • Micronized silver and ceramic particles optimised for modern high-power CPUs

Premium silver thermal compound

Arctic Silver 5 is a high-performance thermal paste formulated with 99.9% pure silver in three particle shapes plus sub-micron ceramic fillers. The compound achieves over 88% thermally conductive filler by weight for maximum particle-to-particle contact. A proprietary polysynthetic oil suspension provides controlled triple-phase viscosity without silicone. Supplied in a 3.5 gram tube for multiple CPU applications.

Verify cooler mounting and surface prep

Ensure the heatsink or water-block mounting hardware supplies even pressure across the CPU integrated heat spreader. Both mating surfaces must be clean, dry and free of old paste residue before application. The compound is electrically non-conductive but slightly capacitive, so avoid bridging exposed surface-mount components near the die. No specific socket or chipset compatibility checks are required beyond mechanical fit.

Long-term stability and thermal behaviour

The high-density filler matrix resists pump-out and separation through repeated thermal cycles. In normal operation the paste maintains consistent bond-line thickness without hardening or drying out. Thermal resistance remains low across typical desktop CPU power ranges. The 3.5 g volume covers several installations, reducing the need for frequent re-application.

Акценти

  • Maximises heat transfer with 99.9% pure silver particles
  • Over 88% thermally conductive filler by weight for high density
  • Triple-phase viscosity ensures stable application without silicone
  • 5 g tube covers multiple CPU installations
  • Micronized silver and ceramic particles optimised for modern high-power CPUs

Спецификации

BrandArctic Silver
ModelAS-AS5-35
FeaturesWith its unique high density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 is the reference premium thermal compound optimised for a wide range of bond lines between modern high power CPUs and performance heatsinks or water cooling solutions.
Made With 99.9% Pure Silver: Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximise particle to particle contact area and thermal transfer.
High Density: Arctic Silver 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, A

Въпроси за този артикул

What comes in the 3.5g tube and do I need any extra tools?

The tube contains Arctic Silver 5 thermal compound only. No applicator or cleaning supplies are included, so have isopropyl alcohol and a lint-free cloth ready for surface preparation.

How does the 88% filler loading affect which version I should pick?

Arctic Silver 5 is a single formulation with over 88% thermally conductive filler by weight. There are no alternative capacities or versions in this listing, so the 3.5g tube is the only choice.

What does the 99.9% pure silver content mean for actual CPU temperatures?

The compound uses three particle shapes of 99.9% pure silver plus ceramic fillers to maximise contact area. In practice this yields lower thermal resistance across the bond line between a high-power CPU and its heatsink or water block.

Още от този рафт

Често сравнявани заедно

Същият рафт, същата каса — осем монети и заключване на курса за 30 минути.