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Проследени артикули Вход
Silver 2U rack server with 24 front drive bays and bezel

DELL

DELL PowerEdge R750 24 Bay 2.5" 2U 2x Xeon Gold 6330 2.0GHz 28 Core 768GB DDR4 24x 1.92TB SSD H755

SKU CH-SVA0-TZJ0Y

2U rack server with dual Xeon Gold 6330 28-core CPUs, 768GB DDR4, H755 RAID controller, and 24x 1.92TB SATA SSDs

  • TypeRack
  • Rack Height2U
  • Redundant Hot-swap PowerYes
  • CPU TypeIntel Xeon
  • CPU Speed2.00 GHz
  • CPU SocketLGA 4189
  • Dual Xeon Gold 6330 processors provide 28 cores each for multi-threaded workloads
  • 768 GB DDR4 2933 MHz ECC memory supports large virtualisation and database deployments
  • PERC H755 RAID controller with 8 GB NV cache enables RAID 0, 1, 5, 6, 10, 50, 60
  • 24 enterprise 1.92 TB SATA SSDs deliver high-capacity flash storage in 2.5 inch bays
  • iDRAC 9 Enterprise and dual 1400 W platinum power supplies ensure remote management and power redundancy

DELL PowerEdge R750 2U Server

The DELL PowerEdge R750 is a 2U rack server built for enterprise workloads. It ships with two Intel Xeon Gold 6330 processors running at 2.0 GHz with 28 cores each. The system includes 768 GB of DDR4 2933 MHz registered ECC memory across 24 slots. A Dell PERC H755 RAID controller with 8 GB NV cache manages the storage array.

24-Bay 2.5" Storage Configuration

This server suits organisations that need high-density flash storage in a 2U form factor. Twenty-four 1.92 TB SATA SSDs provide a large all-flash pool for databases or virtualisation. Buyers who require 3.5" drive bays, NVMe U.2 slots, or a smaller 1U chassis should look at other platforms. The fixed 24-bay 2.5" backplane cannot be reconfigured for larger drives.

Dual 1400 W Platinum Power Supplies

Redundant hot-swap 1400 W platinum-efficiency power supplies deliver the power budget for both CPUs, full memory population, and all 24 SSDs. The installed CPUs use the LGA 4189 socket and the system supports a maximum of two processors. No additional CPU upgrades are possible beyond the two Gold 6330 units already installed.

Акценти

  • Dual Xeon Gold 6330 processors provide 28 cores each for multi-threaded workloads
  • 768 GB DDR4 2933 MHz ECC memory supports large virtualisation and database deployments
  • PERC H755 RAID controller with 8 GB NV cache enables RAID 0, 1, 5, 6, 10, 50, 60
  • 24 enterprise 1.92 TB SATA SSDs deliver high-capacity flash storage in 2.5 inch bays
  • iDRAC 9 Enterprise and dual 1400 W platinum power supplies ensure remote management and power redundancy

Спецификации

BrandDELL
SeriesPowerEdge R750
ModelR750
TypeRack
Rack Height2U
Redundant Hot-swap PowerYes
CPU TypeIntel Xeon
CPU Speed2.00 GHz
CPU SocketLGA 4189
Number of CPU Cores28-Core Processor
CPU FeaturesGold 6330
# of Processors Installed2
MAX Processors2
Chipset0
Installed Memory Size768GB
Memory TypeDDR4
Max Memory Capacity0
Number of Memory Slots32
Storage ControllerDell Perc H755 Controller
HDD InterfaceSATA
SSD (Installed)24 x 1.92TB SATA SSD
Raid LevelRAID 0/1/5/6/10/50/60
Max HDD CapacityNone
Media Drives0
GPU TypeMatrox G200
Video Memory8MB
Ethernet ControllerDell EMC 15G Broadcom 57412 Dual Port 10GbE SFP+ OCP 3.0 Network Card
LAN Ports2 x Ports
Expansion Slots0
Management PortRJ 45
Operating SystemNo
Features24 x 2.5" SATA/SAS Hot-Plug Drive Bays

Въпроси за този артикул

How are the 24 SATA SSDs installed in the 2.5" drive bays, and what step is often missed?

Slide each 2.5" drive into a hot-swap carrier until it clicks, then insert the carrier into the front bay until the latch engages; the step often missed is securing the carrier latch fully so the drive registers with the PERC H755 controller.

Which components will need replacement first under continuous operation?

The two 1400 W platinum power supplies and the cooling fans are the primary field-replaceable units; the PERC H755's 8 GB NV cache battery also degrades over time and should be swapped per the iDRAC 9 health alerts.

What thermal or power limit appears first when both Xeon Gold 6330 CPUs run at 3.1 GHz turbo under sustained load?

The 1400 W redundant PSU rating and the 2U chassis airflow ceiling constrain total package power before the CPUs hit their maximum turbo frequency for extended periods.

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