Dynatron

Dynatron B8 CPU cooler Socket FCLGA 3647 Narrow ILM 205W 108x80x64mm 600g

SKU CH-222Y-G4GVZ MPN B8

A compact 108x80x64mm aluminium fin stack on a copper base with four heat pipes dissipates up to 205W for Intel FCLGA 3647 narrow ILM servers and includes Shin-Etsu 7762 thermal grease

TypeHeatsinks only
Heatsink MaterialAluminum Stacked fin soldered on Copper base with 4x Heat Pi
Heatsink Dimensions108.00 x 80.00 x 64.00 mm
Weight600g
FeaturesThermal Grease Shin-Etsu 7762 Pre-printed Support CPU power

Dissipates up to 205 W TDP with four embedded heat pipes
Copper base transfers heat fast into stacked aluminium fins
Shin-Etsu 7762 thermal grease pre-applied for quick install
Compact 108.00 x 80.00 x 64.00 mm footprint fits 2U chassis
Includes both fabric and non-fabric package carriers

25,99 $

0.00033094 BTC με τη σημερινή ισοτιμία

Διαθέσιμο · αποστολή σήμερα

Το ταμείο κλειδώνει την ισοτιμία σας για 30 λεπτά.

Παράδοση προς Ηνωμένες Πολιτείες εκτίμηση

UPS Worldwide Expedited 3–6 εργάσιμες ημέρες 39,90 $
DHL Express Worldwide 2–3 εργάσιμες ημέρες 74,90 $

Προσθέστε 373,01 $ ακόμη και η βασική αποστολή γίνεται δωρεάν.

Οι εισαγωγικοί δασμοί επιβάλλονται κατά την άφιξη από τη χώρα σας.

Αποστολή αλλού

Socket FCLGA 3647 narrow ILM cooler

The Dynatron B8 is a passive heatsink assembly built for processors that use the FCLGA 3647 socket with a narrow integrated loading mechanism. It combines an aluminium stacked-fin array soldered to a copper base with four embedded heat pipes. Shin-Etsu 7762 thermal grease is pre-printed on the base for immediate installation.

Suitable for 2U servers needing up to 205 W

This cooler targets 2U server builds where the CPU thermal design power reaches 205 W and the mounting pattern matches the narrow ILM. It includes both fabric and non-fabric package carriers to fit either carrier style. Builders needing active airflow, a different socket, or support beyond 205 W should look at other solutions.

205 W maximum CPU heat dissipation

The single figure that determines fit is the rated 205 W heat-dissipation limit. If the processor’s thermal output exceeds this value the heatsink cannot guarantee adequate cooling. Verify the CPU’s rated power against this ceiling before purchase.

Βασικά χαρακτηριστικά

Dissipates up to 205 W TDP with four embedded heat pipes
Copper base transfers heat fast into stacked aluminium fins
Shin-Etsu 7762 thermal grease pre-applied for quick install
Compact 108.00 x 80.00 x 64.00 mm footprint fits 2U chassis
Includes both fabric and non-fabric package carriers

Προδιαγραφές

Brand	Dynatron
Model	B8
Type	Heatsinks only
Heatsink Material	Aluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded
Heatsink Dimensions	108.00 x 80.00 x 64.00 mm
Weight	600g
Features	Thermal Grease Shin-Etsu 7762 Pre-printed Support CPU power up to 205 Watts heat dissipation Includes both Fabric and Non-Fabric Package Carriers
Βάρος αποστολής	0.73 kg
Διαστάσεις συσκευασίας	132 × 112 × 104 mm

Ερωτήσεις για αυτό το προϊόν

Should I pick the Fabric or Non-Fabric carrier for my FCLGA 3647 Narrow ILM socket?

Both carriers are included; use the Fabric carrier when the motherboard has a narrow ILM with a fabric retention frame, otherwise use the Non-Fabric carrier.

What does the 205 W rating mean once the cooler is mounted in a 2U server?

The aluminium stacked-fin array soldered to a copper base with four embedded heat pipes is rated to dissipate up to 205 W of CPU heat in a 2U chassis.

How does the FCLGA 3647 Narrow ILM mounting interface limit cooler height?

The cooler stands 64.00 mm tall, fitting the 2U form factor required by the narrow ILM socket specification.

Επίσης σε αυτό το ράφι