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Compact silver fin stack on copper base, four embedded heat pipes, low-profile rectangular block

Dynatron

Dynatron B8 CPU cooler Socket FCLGA 3647 Narrow ILM 205W 108x80x64mm 600g

SKU CH-222Y-G4GVZ MPN B8

A compact 108x80x64mm aluminium fin stack on a copper base with four heat pipes dissipates up to 205W for Intel FCLGA 3647 narrow ILM servers and includes Shin-Etsu 7762 thermal grease

  • TypeHeatsinks only
  • Heatsink MaterialAluminum Stacked fin soldered on Copper base with 4x Heat Pi
  • Heatsink Dimensions108.00 x 80.00 x 64.00 mm
  • Weight600g
  • FeaturesThermal Grease Shin-Etsu 7762 Pre-printed Support CPU power
  • Dissipates up to 205 W TDP with four embedded heat pipes
  • Copper base transfers heat fast into stacked aluminium fins
  • Shin-Etsu 7762 thermal grease pre-applied for quick install
  • Compact 108.00 x 80.00 x 64.00 mm footprint fits 2U chassis
  • Includes both fabric and non-fabric package carriers

Socket FCLGA 3647 narrow ILM cooler

The Dynatron B8 is a passive heatsink assembly built for processors that use the FCLGA 3647 socket with a narrow integrated loading mechanism. It combines an aluminium stacked-fin array soldered to a copper base with four embedded heat pipes. Shin-Etsu 7762 thermal grease is pre-printed on the base for immediate installation.

Suitable for 2U servers needing up to 205 W

This cooler targets 2U server builds where the CPU thermal design power reaches 205 W and the mounting pattern matches the narrow ILM. It includes both fabric and non-fabric package carriers to fit either carrier style. Builders needing active airflow, a different socket, or support beyond 205 W should look at other solutions.

205 W maximum CPU heat dissipation

The single figure that determines fit is the rated 205 W heat-dissipation limit. If the processor’s thermal output exceeds this value the heatsink cannot guarantee adequate cooling. Verify the CPU’s rated power against this ceiling before purchase.

Besonderheiten

  • Dissipates up to 205 W TDP with four embedded heat pipes
  • Copper base transfers heat fast into stacked aluminium fins
  • Shin-Etsu 7762 thermal grease pre-applied for quick install
  • Compact 108.00 x 80.00 x 64.00 mm footprint fits 2U chassis
  • Includes both fabric and non-fabric package carriers

Technische Daten

BrandDynatron
ModelB8
TypeHeatsinks only
Heatsink MaterialAluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded
Heatsink Dimensions108.00 x 80.00 x 64.00 mm
Weight600g
FeaturesThermal Grease Shin-Etsu 7762 Pre-printed
Support CPU power up to 205 Watts heat dissipation
Includes both Fabric and Non-Fabric Package Carriers
Versandgewicht0.73 kg
Paketgröße132 × 112 × 104 mm

Fragen zu diesem Artikel

Should I pick the Fabric or Non-Fabric carrier for my FCLGA 3647 Narrow ILM socket?

Both carriers are included; use the Fabric carrier when the motherboard has a narrow ILM with a fabric retention frame, otherwise use the Non-Fabric carrier.

What does the 205 W rating mean once the cooler is mounted in a 2U server?

The aluminium stacked-fin array soldered to a copper base with four embedded heat pipes is rated to dissipate up to 205 W of CPU heat in a 2U chassis.

How does the FCLGA 3647 Narrow ILM mounting interface limit cooler height?

The cooler stands 64.00 mm tall, fitting the 2U form factor required by the narrow ILM socket specification.

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