We take cryptocurrency — so the coins you hold can buy real hardware.Pay in crypto, spend it on real hardware. Free insured shipping worldwide over $399. Plain, unbranded boxes, sent from Germany.Free insured shipping over $399. Your rate is locked for 30 minutes once checkout opens.Rate locked 30 minutes. Every item sealed, serial-checked and covered by a 24-month warranty.Sealed, 24-month warranty.

Saved items Sign in
Compact silver fin stack on copper base, four embedded heat pipes, low-profile rectangular block

Dynatron

Dynatron B8 CPU cooler Socket FCLGA 3647 Narrow ILM 205W 108x80x64mm 600g

SKU CH-222Y-G4GVZ MPN B8

A compact 108x80x64mm aluminium fin stack on a copper base with four heat pipes dissipates up to 205W for Intel FCLGA 3647 narrow ILM servers and includes Shin-Etsu 7762 thermal grease

  • TypeHeatsinks only
  • Heatsink MaterialAluminum Stacked fin soldered on Copper base with 4x Heat Pi
  • Heatsink Dimensions108.00 x 80.00 x 64.00 mm
  • Weight600g
  • FeaturesThermal Grease Shin-Etsu 7762 Pre-printed Support CPU power
  • Dissipates up to 205 W TDP with four embedded heat pipes
  • Copper base transfers heat fast into stacked aluminium fins
  • Shin-Etsu 7762 thermal grease pre-applied for quick install
  • Compact 108.00 x 80.00 x 64.00 mm footprint fits 2U chassis
  • Includes both fabric and non-fabric package carriers

Socket FCLGA 3647 narrow ILM cooler

The Dynatron B8 is a passive heatsink assembly built for processors that use the FCLGA 3647 socket with a narrow integrated loading mechanism. It combines an aluminium stacked-fin array soldered to a copper base with four embedded heat pipes. Shin-Etsu 7762 thermal grease is pre-printed on the base for immediate installation.

Suitable for 2U servers needing up to 205 W

This cooler targets 2U server builds where the CPU thermal design power reaches 205 W and the mounting pattern matches the narrow ILM. It includes both fabric and non-fabric package carriers to fit either carrier style. Builders needing active airflow, a different socket, or support beyond 205 W should look at other solutions.

205 W maximum CPU heat dissipation

The single figure that determines fit is the rated 205 W heat-dissipation limit. If the processor’s thermal output exceeds this value the heatsink cannot guarantee adequate cooling. Verify the CPU’s rated power against this ceiling before purchase.

Highlights

  • Dissipates up to 205 W TDP with four embedded heat pipes
  • Copper base transfers heat fast into stacked aluminium fins
  • Shin-Etsu 7762 thermal grease pre-applied for quick install
  • Compact 108.00 x 80.00 x 64.00 mm footprint fits 2U chassis
  • Includes both fabric and non-fabric package carriers

Specifications

BrandDynatron
ModelB8
TypeHeatsinks only
Heatsink MaterialAluminum Stacked fin soldered on Copper base with 4x Heat Pipes embedded
Heatsink Dimensions108.00 x 80.00 x 64.00 mm
Weight600g
FeaturesThermal Grease Shin-Etsu 7762 Pre-printed
Support CPU power up to 205 Watts heat dissipation
Includes both Fabric and Non-Fabric Package Carriers
Shipping weight0.73 kg
Package size132 × 112 × 104 mm

Questions about this item

Should I pick the Fabric or Non-Fabric carrier for my FCLGA 3647 Narrow ILM socket?

Both carriers are included; use the Fabric carrier when the motherboard has a narrow ILM with a fabric retention frame, otherwise use the Non-Fabric carrier.

What does the 205 W rating mean once the cooler is mounted in a 2U server?

The aluminium stacked-fin array soldered to a copper base with four embedded heat pipes is rated to dissipate up to 205 W of CPU heat in a 2U chassis.

How does the FCLGA 3647 Narrow ILM mounting interface limit cooler height?

The cooler stands 64.00 mm tall, fitting the 2U form factor required by the narrow ILM socket specification.

Also in this aisle

People compared these

Same shelf, same checkout — eight coins and a 30-minute rate lock.