AMD EPYC 7302 100-100000043WOF 16-core 3.0 GHz server processor
- EPYC 7302
- Socket SP3
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AMD
16-core server processor with 3.0 GHz base clock, 3.3 GHz boost, 128 MB L3 cache, eight-channel DDR4-3200 support and 128 lanes of PCIe 4.0 in a 155 W SP3 package
The AMD EPYC 7302P is a 16-core, 32-thread server CPU built for single-socket platforms. It runs at a 3.0 GHz base frequency with a 3.3 GHz max boost. The chip provides 128 MB of L3 cache and supports eight-channel DDR4 3200 memory. A 155 W TDP and SP3 socket complete the package.
This processor targets single-socket servers that need high core counts and memory bandwidth. The 1P socket count means it will not function in dual-processor boards. Buyers who need multi-socket scaling or lower power envelopes should look at other parts.
The chip delivers 128 lanes of PCI Express 4.0 directly from the CPU. This bandwidth supports large numbers of add-in cards, storage controllers or accelerators without a chipset bottleneck. Verify that your chassis and backplane can route the required lane count.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7302P |
| Model | 100-100000049WOF |
| CPU Socket Type | Socket SP3 |
| # of Cores | 16-Core |
| # of Threads | 32 |
| Operating Frequency | 3.0 GHz |
| Max Turbo Frequency | 3.3 GHz |
| L3 Cache | 128MB |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 155W |
| Cooling Device | Cooling device not included - Processor Only |
| Težina pošiljke | 3.18 kg |
| Dimenzije pakiranja | 178 × 178 × 178 mm |
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Align the gold triangle on the processor with the socket corner, lower the retention frame evenly, then torque the captive screws in a cross pattern to the specified value; the step often missed is applying the correct torque sequence, which prevents uneven contact and memory-training failures.
The processor itself has no user-serviceable parts; plan to replace the thermal interface material and inspect the heatsink mounting pressure whenever the cooler is removed, and verify that the system firmware stays current for microcode updates.
The 155W thermal design power is the first ceiling; if the cooling solution cannot dissipate that heat continuously, the processor will reduce frequency below the base clock to stay within its thermal envelope.
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