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Square green ceramic processor with gold contacts and silver heat spreader, retail box visible

AMD

AMD EPYC 7302P 100-100000049WOF 16-core 3.0 GHz server processor

SKU CH-MBQ4-4V44T MPN 100-100000049WOF

16-core server processor with 3.0 GHz base clock, 3.3 GHz boost, 128 MB L3 cache, eight-channel DDR4-3200 support and 128 lanes of PCIe 4.0 in a 155 W SP3 package

  • NameEPYC 7302P
  • CPU Socket TypeSocket SP3
  • # of Cores16-Core
  • # of Threads32
  • Operating Frequency3.0 GHz
  • Max Turbo Frequency3.3 GHz

Option 7302P

  • 16 cores and 32 threads for high parallel throughput
  • 128 MB L3 cache accelerates data-intensive workloads
  • Eight-channel DDR4 3200 memory controller increases bandwidth
  • 128 PCIe 4.0 lanes support dense I/O configurations
  • 155 W TDP balances performance and thermal envelope

16-Core EPYC 7302P Server Processor

The AMD EPYC 7302P is a 16-core, 32-thread server CPU built for single-socket platforms. It runs at a 3.0 GHz base frequency with a 3.3 GHz max boost. The chip provides 128 MB of L3 cache and supports eight-channel DDR4 3200 memory. A 155 W TDP and SP3 socket complete the package.

Suited for dense 1P servers.

This processor targets single-socket servers that need high core counts and memory bandwidth. The 1P socket count means it will not function in dual-processor boards. Buyers who need multi-socket scaling or lower power envelopes should look at other parts.

128 PCIe 4.0 lanes for I/O-heavy workloads

The chip delivers 128 lanes of PCI Express 4.0 directly from the CPU. This bandwidth supports large numbers of add-in cards, storage controllers or accelerators without a chipset bottleneck. Verify that your chassis and backplane can route the required lane count.

Najważniejsze cechy

  • 16 cores and 32 threads for high parallel throughput
  • 128 MB L3 cache accelerates data-intensive workloads
  • Eight-channel DDR4 3200 memory controller increases bandwidth
  • 128 PCIe 4.0 lanes support dense I/O configurations
  • 155 W TDP balances performance and thermal envelope

Specyfikacja

BrandAMD
SeriesAMD EPYC 7002
NameEPYC 7302P
Model100-100000049WOF
CPU Socket TypeSocket SP3
# of Cores16-Core
# of Threads32
Operating Frequency3.0 GHz
Max Turbo Frequency3.3 GHz
L3 Cache128MB
Integrated Memory Controller SpeedDDR4 3200
Memory Channel8 Channel
PCI Express Revision4.0
Max # of PCI Express Lanes128
Thermal Design Power155W
Cooling DeviceCooling device not included - Processor Only
Waga przesyłki3.18 kg
Wymiary opakowania178 × 178 × 178 mm

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

How do I install this EPYC 7302P into a Socket SP3 motherboard and what step is often missed?

Align the gold triangle on the processor with the socket corner, lower the retention frame evenly, then torque the captive screws in a cross pattern to the specified value; the step often missed is applying the correct torque sequence, which prevents uneven contact and memory-training failures.

What maintenance or replacement will this 155W processor need over its service life?

The processor itself has no user-serviceable parts; plan to replace the thermal interface material and inspect the heatsink mounting pressure whenever the cooler is removed, and verify that the system firmware stays current for microcode updates.

What limit appears first when all 16 cores run sustained workloads at 3.0 GHz?

The 155W thermal design power is the first ceiling; if the cooling solution cannot dissipate that heat continuously, the processor will reduce frequency below the base clock to stay within its thermal envelope.

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