Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.

Praćeni artikli Prijava
Square green ceramic processor with gold contact pads and silver heat spreader labelled EPYC 7702P

AMD

AMD EPYC 7702P 100-000000047 64-core 2.0 GHz server processor

SKU CH-AYPF-CWCMQ MPN 100-000000047

64-core server processor with 128 threads, 2.0 GHz base and 3.35 GHz boost, 256 MB L3 cache, eight-channel DDR4-3200 memory controller and 128 PCIe 4.0 lanes

  • NameEPYC 7702P
  • CPU Socket TypeSocket SP3
  • # of Cores64-Core
  • # of Threads128
  • Operating Frequency2.0 GHz
  • Max Turbo Frequency3.35 GHz
  • 64 cores and 128 threads handle massive parallel workloads
  • 256 MB L3 cache reduces latency for data-intensive tasks
  • 8-channel DDR4-3200 memory controller feeds all cores with high bandwidth
  • 128 PCIe 4.0 lanes provide extensive I/O connectivity for storage and networking
  • 7 nm process technology delivers high core density within a 200 W thermal envelope

AMD EPYC 7702P 64-core server processor

The AMD EPYC 7702P is a 64-core server processor built for Socket SP3 platforms. It runs at a 2.0 GHz base frequency and reaches 3.35 GHz maximum turbo. The chip provides 256 MB L3 cache and 32 MB L2 cache. It supports 8-channel DDR4-3200 memory and 128 lanes of PCIe 4.0. The thermal design power is 200 W and no cooler is included.

Suited for high-thread-count server workloads

This processor suits workloads that benefit from 64 cores and 128 threads such as virtualisation, cloud hosting and data analytics. The eight memory channels and 128 PCIe 4.0 lanes help reduce bottlenecks in memory-heavy or I/O-heavy deployments. Builders who need a lower core count, lower power envelope or a different socket should look at other options. Buyers requiring an integrated cooling solution must source it separately.

200 W TDP dictates cooling and power budget

The 200 W thermal design power is the single figure that determines whether this part fits your chassis and power infrastructure. A compatible Socket SP3 motherboard and adequate cooling capable of dissipating 200 W are mandatory. The processor does not ship with a cooler. Verify your platform supports this TDP before purchase.

Istaknuto

  • 64 cores and 128 threads handle massive parallel workloads
  • 256 MB L3 cache reduces latency for data-intensive tasks
  • 8-channel DDR4-3200 memory controller feeds all cores with high bandwidth
  • 128 PCIe 4.0 lanes provide extensive I/O connectivity for storage and networking
  • 7 nm process technology delivers high core density within a 200 W thermal envelope

Specifikacije

BrandAMD
SeriesAMD EPYC 7002
NameEPYC 7702P
Model100-000000047
CPU Socket TypeSocket SP3
# of Cores64-Core
# of Threads128
Operating Frequency2.0 GHz
Max Turbo Frequency3.35 GHz
L3 Cache256MB
64-Bit SupportYes
Integrated Memory Controller SpeedDDR4 3200
Memory Channel8 Channel
PCI Express Revision4.0
Max # of PCI Express Lanes128
Thermal Design Power200W
Cooling DeviceCooling device not included - Processor Only
Težina pošiljke0.91 kg
Dimenzije pakiranja406 × 305 × 254 mm

Pitanja o ovom artiklu

Will the SP3 socket and 200 W TDP fit in my 2U server chassis?

The processor uses the SP3 socket and has a 200 W TDP; verify your motherboard supports SP3 and that your cooler and chassis airflow are rated for at least 200 W.

Do I need to update the motherboard BIOS before installing the 64-core 7702P?

Most SP3 boards require a BIOS update to support the 7002 series; apply the latest vendor firmware before seating the CPU, then confirm the 2.0 GHz base clock appears in POST.

When should I replace the thermal paste on this 7 nm 64-core chip?

Reapply quality thermal compound every two to three years or whenever the cooler is removed, because the 200 W 7 nm die generates sustained heat that degrades paste over time.

Također u ovoj kategoriji

Kupci su usporedili ovo

Ista polica, ista blagajna — osam valuta i blokada tečaja na 30 minuta.