NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
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AMD
64-core server processor with 128 threads, 2.0 GHz base and 3.35 GHz boost, 256 MB L3 cache, eight-channel DDR4-3200 memory controller and 128 PCIe 4.0 lanes
The AMD EPYC 7702P is a 64-core server processor built for Socket SP3 platforms. It runs at a 2.0 GHz base frequency and reaches 3.35 GHz maximum turbo. The chip provides 256 MB L3 cache and 32 MB L2 cache. It supports 8-channel DDR4-3200 memory and 128 lanes of PCIe 4.0. The thermal design power is 200 W and no cooler is included.
This processor suits workloads that benefit from 64 cores and 128 threads such as virtualisation, cloud hosting and data analytics. The eight memory channels and 128 PCIe 4.0 lanes help reduce bottlenecks in memory-heavy or I/O-heavy deployments. Builders who need a lower core count, lower power envelope or a different socket should look at other options. Buyers requiring an integrated cooling solution must source it separately.
The 200 W thermal design power is the single figure that determines whether this part fits your chassis and power infrastructure. A compatible Socket SP3 motherboard and adequate cooling capable of dissipating 200 W are mandatory. The processor does not ship with a cooler. Verify your platform supports this TDP before purchase.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7702P |
| Model | 100-000000047 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 64-Core |
| # of Threads | 128 |
| Operating Frequency | 2.0 GHz |
| Max Turbo Frequency | 3.35 GHz |
| L3 Cache | 256MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 200W |
| Cooling Device | Cooling device not included - Processor Only |
| Fraktvekt | 0.91 kg |
| Pakkestørrelse | 406 × 305 × 254 mm |
The processor uses the SP3 socket and has a 200 W TDP; verify your motherboard supports SP3 and that your cooler and chassis airflow are rated for at least 200 W.
Most SP3 boards require a BIOS update to support the 7002 series; apply the latest vendor firmware before seating the CPU, then confirm the 2.0 GHz base clock appears in POST.
Reapply quality thermal compound every two to three years or whenever the cooler is removed, because the 200 W 7 nm die generates sustained heat that degrades paste over time.
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