Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
ARCTIC COOLING
A 145 × 145 mm, 1.5 mm thick silicone thermal pad rated at 6.0 W/mK for filling gaps between chips and heatsinks
This silicone thermal pad measures 145 by 145 millimetres with a 1.5 millimetre thickness. It provides a thermal conductivity of 6.0 W/mK for memory modules and chipset components. The electrically non-conductive material protects sensitive electronics during installation.
Measure the distance between your heatsink and the target component to confirm a 1.5 millimetre pad suits the stack height. Ensure the 145 by 145 millimetre sheet covers the required surface or can be cut to the necessary dimensions.
Rated for continuous operation from minus 40 to 200 degrees Celsius, the pad maintains its physical properties under sustained thermal cycling. Its volume resistance of 1 x 1012 Ohm-centimetre and breakdown voltage of 12 kilovolts per millimetre remain consistent during prolonged load.
| Brand | Arctic |
|---|---|
| Series | Thermal Pad |
| Model | 145*145 |
| Volume / Net Weight | 108g |
| Thermal Conductivity | 6.0 W/mK |
| Long Term Operating Temperature | -40 to 200 C |
| Specifications | Volume resistance: 1 X 1012 O-cm Breakdown Voltage: 12 KV/mm KV/mm Tensile strength: 2.5 Kgf/cm² Kgf/cm² Elongation: 45 % |
| Option | 145 x 145 x 1.5 mm |
| Features | Efficient Thermal Conductivity Filling the Gaps Easy to Apply Safe Handling |
| Weight | Thermal Pads |
The pad is a single 108 g silicone sheet measuring 145 mm by 145 mm by 1.5 mm; no extra adhesive or tools are required as it has natural tack for placement.
Choose this 6.0 W/mK pad when the gap between the component and heatsink is around 1.5 mm and you need electrically non‑conductive thermal transfer up to 200 °C.
It indicates the pad conducts heat at 6.0 watts per metre‑kelvin, filling microscopic gaps and uneven surfaces while remaining electrically isolating at up to 12 kV/mm breakdown voltage.
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