BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
ASUS
Supports AMD Ryzen 7000, 8000 and 9000 series CPUs with 18+2 power stages, DDR5 memory, PCIe 5.0 NVMe M.2 slot with backplate and USB 3.2 Gen 2x2
This AM5 motherboard targets enthusiasts building high-end AMD systems. It supports DDR5 memory and PCIe 5.0 NVMe storage for modern workloads. The board suits gamers and creators who need strong multi-core performance.
Teamed power stages and dual 8-pin connectors deliver stable current to multi-core CPUs. Massive VRM heatsinks, an integrated aluminium I/O cover and an L-shaped heatpipe dissipate heat efficiently. An M.2 backplate and three onboard M.2 heatsinks keep PCIe 5.0 drives cool during sustained transfers.
These overclocking technologies let users tune performance per core or switch profiles automatically. AI Cooling II manages fan speeds based on system load. Builders who do not need advanced per-core tuning or extensive RGB ecosystems may prefer a simpler platform.
| CPU Socket Type | AM5 |
|---|
The PCIe 5.0 M.2_1 slot runs at full 5.0 x4 bandwidth, so a compatible NVMe drive can reach its rated sequential throughput without interface bottleneck.
The VRM heatsinks and integrated I/O cover sit close to the AM5 socket; low-profile or offset coolers fit best, while tall tower coolers may require offset brackets to clear the heatsink fins.
Remove the pre-fitted M.2 screw, place the drive, secure it with the standoff, then attach the backplate using its captive screws — the missed step is forgetting to peel the protective film from the backplate thermal pad before tightening.
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