NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
HPE
28-core Xeon server processor running at 2 GHz with 56 threads and 52.50 MB L3 cache for DDR5 platforms
This HPE server processor is an Intel Xeon Gold 5420+ with 28 cores and a 2 GHz base clock. It delivers 56 threads and 52.50 MB of L3 cache for multi-threaded workloads. The CPU fits the LGA 4677 socket and supports DDR5 memory at 4.40 GHz. Thermal design power is rated at 205 W.
The 28-core design and 56 threads suit virtualisation hosts, database nodes and render farms that need high core counts. Intel Virtualization Technology and Trusted Execution Technology are included. Buyers who need lower power draw or fewer cores for lighter tasks should consider other options. The 205 W TDP requires robust server cooling infrastructure.
This processor only works with motherboards that provide an LGA 4677 socket and can handle a 205 W thermal design power. The 52.50 MB L3 cache and 4.10 GHz maximum turbo frequency are fixed specifications. Verify that your server platform supports the LGA 4677 package and the required power delivery before purchase.
| CPU Socket Type | LGA 4677 |
|---|---|
| Težina pošiljke | 0.45 kg |
| Dimenzije pakiranja | 287 × 216 × 30 mm |
The processor has a 205 W thermal design power, so the server chassis and cooler must be rated to dissipate at least that much heat continuously.
The 97 °C thermal specification is the first hard limit; sustained workloads will throttle once the die reaches that temperature.
At 205 W TDP the chip produces significant heat; fan noise depends on the chassis airflow design, but expect active cooling to run at higher speeds continuously.
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