NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Vi tager imod kryptovaluta — så den krypto, du ejer, kan købe rigtig hardware.Betal med krypto, brug det på rigtig hardware. Gratis, forsikret levering til hele verden ved køb over 399 $. Neutrale, umærkede papkasser, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Din kurs låses i 30 minutter, så snart kassen åbner.Kurs låst i 30 minutter. Hver vare er forseglet, har kontrolleret serienummer og er dækket af 24 måneders garanti.Forseglet, 24 måneders garanti.
HPE
28-core Xeon server processor running at 2 GHz with 56 threads and 52.50 MB L3 cache for DDR5 platforms
This HPE server processor is an Intel Xeon Gold 5420+ with 28 cores and a 2 GHz base clock. It delivers 56 threads and 52.50 MB of L3 cache for multi-threaded workloads. The CPU fits the LGA 4677 socket and supports DDR5 memory at 4.40 GHz. Thermal design power is rated at 205 W.
The 28-core design and 56 threads suit virtualisation hosts, database nodes and render farms that need high core counts. Intel Virtualization Technology and Trusted Execution Technology are included. Buyers who need lower power draw or fewer cores for lighter tasks should consider other options. The 205 W TDP requires robust server cooling infrastructure.
This processor only works with motherboards that provide an LGA 4677 socket and can handle a 205 W thermal design power. The 52.50 MB L3 cache and 4.10 GHz maximum turbo frequency are fixed specifications. Verify that your server platform supports the LGA 4677 package and the required power delivery before purchase.
| CPU Socket Type | LGA 4677 |
|---|---|
| Forsendelsesvægt | 0.45 kg |
| Pakkestørrelse | 287 × 216 × 30 mm |
The processor has a 205 W thermal design power, so the server chassis and cooler must be rated to dissipate at least that much heat continuously.
The 97 °C thermal specification is the first hard limit; sustained workloads will throttle once the die reaches that temperature.
At 205 W TDP the chip produces significant heat; fan noise depends on the chassis airflow design, but expect active cooling to run at higher speeds continuously.
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