NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
Intel
An 8-core, 16-thread Xeon server processor running at 3.3 GHz with a 4 GHz boost, 24.75 MB cache and 130 W TDP for LGA 3647 platforms
The Intel Xeon Gold 6234 is an eight-core server processor built for LGA 3647 platforms. It runs at a base frequency of 3.3 GHz and supports 16 threads through Hyper-Threading. The chip targets workloads that benefit from strong single-thread speed rather than maximum core count.
The operating frequency sits at 3.3 GHz with Intel Turbo Boost Technology 2.0 raising it to 4 GHz when thermal headroom allows. This combination decides whether the part fits latency-sensitive tasks that need sustained high frequency on fewer cores. The 24.75 MB cache and six memory channels at 2933 MHz feed data to keep those cores busy.
A thermal design power of 130 W defines the cooling requirement for continuous operation at base speed. Under prolonged heavy load the processor will maintain 3.3 GHz within that envelope, while the 4 GHz boost remains opportunistic and time-limited by temperature. The 14 nm lithography and supported instruction sets such as AES-NI and TSX-NI remain active throughout.
| Series | Intel Xeon Gold |
|---|---|
| CPU Socket Type | LGA 3647 |
| Operating Frequency | 3.3 GHz |
| Težina pošiljke | 0.23 kg |
| Dimenzije pakiranja | 102 × 51 × 51 mm |
The 3.3 GHz base frequency is the guaranteed minimum speed across all 8 cores under load, with Intel Turbo Boost 2.0 able to raise clocks up to 4 GHz when thermal headroom allows.
The processor provides PCIe 3.0 lanes, capping each lane at 8 GT/s; total throughput depends on the motherboard's lane allocation for add-in cards.
LGA 3647 uses a narrow ILM mounting pattern and the chip has a 130 W TDP, so the cooler and VRM must be rated for that socket and thermal envelope.
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