Tripp Lite SMART2200RM2U 1950VA 1950W 120V UPS 7 Outlets 2U Rack/Tower
- 120V
- 80 - 151V; adjustab…
Við tökum við rafmynt — svo myntirnar sem þú átt geta keypt alvöru vélbúnað.Greiddu í rafmynt, eyddu henni í alvöru vélbúnað. Frí, tryggð sending um allan heim fyrir pantanir yfir 399 $. Hlutlausir pappakassar án merkinga, sendir frá Þýskalandi.Frí, tryggð sending yfir 399 $. Gengið þitt er læst í 30 mínútur um leið og greiðsluferlið hefst.Gengið læst í 30 mínútur. Hver vara er innsigluð, raðnúmer hennar yfirfarið, og hún nýtur 24 mánaða ábyrgðar.Innsiglað, með 24 mánaða ábyrgð.
Corsair
Premium zinc-oxide thermal compound with 3.8 W/mK conductivity and ultra-low 0.01 °C-in²/W impedance for CPU and GPU heat transfer
Corsair TM30 is a premium zinc oxide thermal compound supplied in a 3.5 g syringe. It targets enthusiasts who want to lower CPU or GPU temperatures during new builds or when replacing aged paste. The material is non-conductive, non-toxic and contains no volatile compounds.
The 2300 K cPs viscosity lets the paste spread easily and fill microscopic abrasions on the heat spreader. Ultra-low thermal impedance of 0.01 °C-in²/W improves heat transfer compared with common pastes. High-stability liquid compound resists drying, cracking or consistency change for years after application.
Low viscosity allows smooth dispensing directly from the syringe onto the die or heat spreader. Non-conductive formulation prevents short circuits if excess material contacts nearby components. No curing time or special tools are required; the paste is ready for immediate use after installation. Buyers needing larger volumes for multiple systems or industrial use may find the 3.5 g quantity insufficient.
| Brand | Corsair |
|---|---|
| Series | TM30 Performance Thermal Paste |
| Model | CT-9010001-WW |
| Volume / Net Weight | 3.5g |
| Thermal Conductivity | 3.8 W/mK |
| Specifications | CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds. Net Weight: 3g Thermal Conductivity: 3.8 W/mK Thermal Impedance: 0.01°C -in2/W Viscosity: 2300K cPs Specific Gravity: 2.5g/cm3 |
| Features | Enthusiast CPU Thermal Compound: Premium Zinc Oxide based thermal compound for optimal thermal performance Cools your CPU and GPU: Install new, or replace existing thermal compound on your CPU and GPU to improve heat transfer and lower temperatures Improved CPU Cooling: Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste Fill in the Gap: CORSAIR TM30’s low-viscosity allows it to easily fill microscopic abrasions and channels in your CPU and cooler, for maximum thermal transfer area Long Life: CORSAIR TM30’s high-stability liquid compound lasts for years with n |
| Sendingarþyngd | 0.01 kg |
| Stærð sendingar | 163 × 99 × 3 mm |
The high-stability liquid compound lasts for years with no drying, cracking or change in consistency, so re-application is only needed if the cooler is removed.
Ultra-low thermal impedance of 0.01 °C-in²/W is the limiting factor for heat flow between the die and cooler.
Non-conductive, non-toxic compound contains zero volatile compounds and maintains consistent viscosity during continuous operation.
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