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Small white tube with grey cap and Corsair TM30 label

Corsair

Corsair TM30 CT-9010001-WW Thermal Paste 3.5g 3.8 W/mK

SKU CH-JJ6Z-9SSP3 MPN CT-9010001-WW

Premium zinc-oxide thermal compound with 3.8 W/mK conductivity and ultra-low 0.01 °C-in²/W impedance for CPU and GPU heat transfer

  • Volume / Net Weight3.5g
  • Thermal Conductivity3.8 W/mK
  • SpecificationsCORSAIR TM30 thermal paste helps you push your PC to its lim
  • FeaturesEnthusiast CPU Thermal Compound: Premium Zinc Oxide based th
  • Low thermal impedance of 0.01 °C-in²/W for efficient heat transfer
  • Thermal conductivity of 3.8 W/mK moves heat away from CPU and GPU
  • Low-viscosity 2300K cPs paste fills microscopic gaps for peak contact
  • Non-conductive zinc oxide formula safe for all components
  • Stable compound lasts years without drying or cracking

TM30 Thermal Paste 3.5g 3.8 W/mK

Corsair TM30 is a premium zinc oxide thermal compound supplied in a 3.5 g syringe. It targets enthusiasts who want to lower CPU or GPU temperatures during new builds or when replacing aged paste. The material is non-conductive, non-toxic and contains no volatile compounds.

Low-viscosity formula fills microscopic gaps

The 2300 K cPs viscosity lets the paste spread easily and fill microscopic abrasions on the heat spreader. Ultra-low thermal impedance of 0.01 °C-in²/W improves heat transfer compared with common pastes. High-stability liquid compound resists drying, cracking or consistency change for years after application.

Simple syringe application with minimal risk

Low viscosity allows smooth dispensing directly from the syringe onto the die or heat spreader. Non-conductive formulation prevents short circuits if excess material contacts nearby components. No curing time or special tools are required; the paste is ready for immediate use after installation. Buyers needing larger volumes for multiple systems or industrial use may find the 3.5 g quantity insufficient.

商品特色

  • Low thermal impedance of 0.01 °C-in²/W for efficient heat transfer
  • Thermal conductivity of 3.8 W/mK moves heat away from CPU and GPU
  • Low-viscosity 2300K cPs paste fills microscopic gaps for peak contact
  • Non-conductive zinc oxide formula safe for all components
  • Stable compound lasts years without drying or cracking

商品規格

BrandCorsair
SeriesTM30 Performance Thermal Paste
ModelCT-9010001-WW
Volume / Net Weight3.5g
Thermal Conductivity3.8 W/mK
SpecificationsCORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
FeaturesEnthusiast CPU Thermal Compound: Premium Zinc Oxide based thermal compound for optimal thermal performance
Cools your CPU and GPU: Install new, or replace existing thermal compound on your CPU and GPU to improve heat transfer and lower temperatures
Improved CPU Cooling: Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste
Fill in the Gap: CORSAIR TM30’s low-viscosity allows it to easily fill microscopic abrasions and channels in your CPU and cooler, for maximum thermal transfer area
Long Life: CORSAIR TM30’s high-stability liquid compound lasts for years with n
出貨重量0.01 kg
包裝尺寸163 × 99 × 3 mm

商品問答

How often will the 3.5 g tube of TM30 need to be replaced on a CPU?

The high-stability liquid compound lasts for years with no drying, cracking or change in consistency, so re-application is only needed if the cooler is removed.

What thermal impedance limits sustained heat transfer with the 3.8 W/mK paste?

Ultra-low thermal impedance of 0.01 °C-in²/W is the limiting factor for heat flow between the die and cooler.

Does the zinc-oxide formula pump out or dry out after running all day?

Non-conductive, non-toxic compound contains zero volatile compounds and maintains consistent viscosity during continuous operation.

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