Mēs pieņemam kriptovalūtu — lai tā, kas Jums pieder, varētu nopirkt īstu aparatūru.Maksājiet kriptovalūtā, iztērējiet to īstai aparatūrai. Bezmaksas apdrošināta piegāde visā pasaulē virs 399 $. Vienkāršas, nemarķētas kastes, sūtītas no Vācijas.Bezmaksas apdrošināta piegāde virs 399 $. Jūsu kurss tiek fiksēts uz 30 minūtēm, tiklīdz atveras kase.Kurss fiksēts uz 30 minūtēm. Katra prece ir aizzīmogota, tās sērijas numurs ir pārbaudīts, un uz to attiecas 24 mēnešu garantija.Aizzīmogots, 24 mēnešu garantija.

Uzraudzītās preces Pieteikties
Low-profile copper heatsink for 1U server, LGA1700 socket, 125W passive cooling

Dynatron

Dynatron Q1 1U Passive CPU Cooler LGA1700 125W

SKU CH-NZ7S-EY5ZS MPN Q1

Passive copper heatsink for 1U servers, supporting LGA1700 sockets and 125W TDP

  • Passive design runs silently in 1U servers
  • Copper heatsink dissipates up to 125 W TDP
  • Built for Intel LGA 1700 socket CPUs
  • Fits 1U rack height without blocking adjacent slots
  • New condition ensures full thermal performance out of the box

Socket LGA1700 1U Passive Cooler

The Dynatron Q1 is a passive copper heatsink designed for Intel LGA1700 processors in 1U server chassis. It targets system builders who need silent, zero-maintenance cooling within a single rack-unit height. This cooler suits environments where airflow is managed by the chassis rather than a dedicated fan. It is not for builders who need active cooling for higher thermal loads or overclocking headroom.

Thermal Design for 125W TDP

The heatsink dissipates up to 125 watts of CPU heat without a fan, relying entirely on forced airflow from the server chassis. Copper construction transfers heat efficiently from the processor die to the fin stack. Acoustic output is effectively zero because no moving parts are present. Power draw is nil, as the unit requires no electrical connection.

Sustained Load Behaviour

Under continuous load the cooler maintains thermal equilibrium as long as chassis airflow meets the 125 watt dissipation requirement. Passive operation means performance scales directly with the volume and velocity of air supplied by the system fans. Thermal throttling may occur if chassis airflow is restricted or if the processor exceeds the rated thermal design power.

Priekšrocības

  • Passive design runs silently in 1U servers
  • Copper heatsink dissipates up to 125 W TDP
  • Built for Intel LGA 1700 socket CPUs
  • Fits 1U rack height without blocking adjacent slots
  • New condition ensures full thermal performance out of the box

Specifikācijas

Šai precei pagaidām nav publicētu specifikāciju.

Jautājumi par šo preci

How is the Dynatron Q1 passive cooler installed on an LGA1700 socket?

Align the mounting brackets with the LGA1700 socket holes, apply thermal paste to the CPU, place the copper heatsink, and secure it with the supplied screws. The step often missed is tightening the screws in a diagonal sequence to ensure even pressure.

What maintenance will the Q1 cooler require over time?

As a passive design with no moving parts, the Q1 requires no fan replacement. Periodically remove dust from the copper fins using compressed air to maintain the 125 W heat dissipation capacity.

What thermal limit appears first when the Q1 runs a 125 W load continuously?

The 125 W TDP rating is the ceiling; sustained loads at this level will raise the heatsink temperature until the CPU hits its internal throttle point, as there is no active airflow to increase dissipation.

Arī šajā sadaļā

Klienti arī salīdzināja

Tas pats plaukts, tā pati kase — astoņas kriptovalūtas un kursa fiksēšana uz 30 minūtēm.