NEMIX RAM
NEMIX RAM 32GB DDR4 2666 ECC LRDIMM CL19 2Rx4 1.2V 288-Pin ML21300-324K1 HPE ML110 G9 memory upgrade
32 GB DDR4-2666 ECC load-reduced DIMM for HPE ProLiant ML110 G9 servers
- Capacity32GB
- SpeedDDR4 2666 (PC4 21300)
- ECCYes
- Buffered/RegisteredLoad Reduced
- ChipsetMajor OEM Samsung, Micron, Hynix
- Voltage1.20V
- 32 GB capacity supports heavy virtualization workloads
- DDR4 2666 speed delivers high throughput for server applications
- ECC LRDIMM technology corrects errors to protect data integrity
- 2 V operation reduces power draw in dense configurations
- 288-pin form factor fits HPE ProLiant ML110 G9 memory slots
32 GB DDR4 LRDIMM for HPE ML110 G9
This 32 GB DDR4 load-reduced DIMM runs at 2666 MT/s with CL19 latency and operates at 1.2 V. It is built for the HPE ProLiant ML110 G9 server and carries ECC protection for data integrity. The 2Rx4 organisation and 288-pin form factor match the platform’s memory slots exactly.
Load-reduced design limits electrical load
LRDIMM buffering reduces the number of loads presented to the server’s memory controller, allowing higher capacities per channel than standard RDIMMs. The trade-off is slightly higher latency and power draw compared with registered modules at the same speed. Systems must support the LRDIMM protocol; mixing with RDIMM or UDIMM types is not supported.
Major-brand DRAM chips without a heat spreader
Samsung, Micron or Hynix ICs are used depending on supply, all qualified for enterprise workloads. The bare-module design relies on chassis airflow for cooling, so adequate front-to-rear ventilation in the ML110 G9 is required. The 288-pin edge connector keys only into DDR4 LRDIMM slots, preventing accidental insertion into incompatible sockets.
Priekšrocības
- 32 GB capacity supports heavy virtualization workloads
- DDR4 2666 speed delivers high throughput for server applications
- ECC LRDIMM technology corrects errors to protect data integrity
- 2 V operation reduces power draw in dense configurations
- 288-pin form factor fits HPE ProLiant ML110 G9 memory slots
Specifikācijas
| Brand | NEMIX RAM |
|---|---|
| Series | HPE Server/Workstation Compatible Series Memory |
| Model | HPE DDR4 2666MHZ ECC LRDIMM Load Reduced Server Memory |
| Part Number | ML21300-324K1 |
| Capacity | 32GB |
| Speed | DDR4 2666 (PC4 21300) |
| ECC | Yes |
| Buffered/Registered | Load Reduced |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | HPE |
| CAS Latency | CL19 |
| Heat Spreader | No |
| Type | 288-Pin DDR4 LRDIMM |
| Rank | 2Rx4 |
| Features | DDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible |
| Package Content | 32GB (1X32GB) DDR4 2666MHZ PC4-21300 2Rx4 1.2V CL19 288-PIN ECC LRDIMM Load Reduced Server Memory |
Jautājumi par šo preci
Should I pick the single 32 GB module or combine smaller sticks for my ML110 G9?
The part ML21300-324K1 is a single 32 GB LRDIMM; adding it alone increases capacity by 32 GB without needing matched pairs.
What does the 2666 MT/s rating deliver inside an HPE ProLiant ML110 G9?
The module runs at DDR4 2666 (PC4-21300) with CL19 latency, giving the server its maximum supported memory bandwidth at 1.2 V.
How does the 288-pin LRDIMM interface affect compatibility with the ML110 G9?
The 288-pin DDR4 LRDIMM form factor with load-reduced buffering is the exact slot type the ML110 G9 requires for ECC memory.
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