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Favori ürünler Giriş yap
Green printed circuit board with black memory chips, gold edge connectors, no heat spreader

NEMIX RAM

NEMIX RAM 32GB DDR4 2666 ECC LRDIMM CL19 2Rx4 1.2V 288-Pin ML21300-324K1 HPE ML110 G9 memory upgrade

SKU CH-V0J4-F23C5

32 GB DDR4-2666 ECC load-reduced DIMM for HPE ProLiant ML110 G9 servers

  • Capacity32GB
  • SpeedDDR4 2666 (PC4 21300)
  • ECCYes
  • Buffered/RegisteredLoad Reduced
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • 32 GB capacity supports heavy virtualization workloads
  • DDR4 2666 speed delivers high throughput for server applications
  • ECC LRDIMM technology corrects errors to protect data integrity
  • 2 V operation reduces power draw in dense configurations
  • 288-pin form factor fits HPE ProLiant ML110 G9 memory slots

32 GB DDR4 LRDIMM for HPE ML110 G9

This 32 GB DDR4 load-reduced DIMM runs at 2666 MT/s with CL19 latency and operates at 1.2 V. It is built for the HPE ProLiant ML110 G9 server and carries ECC protection for data integrity. The 2Rx4 organisation and 288-pin form factor match the platform’s memory slots exactly.

Load-reduced design limits electrical load

LRDIMM buffering reduces the number of loads presented to the server’s memory controller, allowing higher capacities per channel than standard RDIMMs. The trade-off is slightly higher latency and power draw compared with registered modules at the same speed. Systems must support the LRDIMM protocol; mixing with RDIMM or UDIMM types is not supported.

Major-brand DRAM chips without a heat spreader

Samsung, Micron or Hynix ICs are used depending on supply, all qualified for enterprise workloads. The bare-module design relies on chassis airflow for cooling, so adequate front-to-rear ventilation in the ML110 G9 is required. The 288-pin edge connector keys only into DDR4 LRDIMM slots, preventing accidental insertion into incompatible sockets.

Öne çıkanlar

  • 32 GB capacity supports heavy virtualization workloads
  • DDR4 2666 speed delivers high throughput for server applications
  • ECC LRDIMM technology corrects errors to protect data integrity
  • 2 V operation reduces power draw in dense configurations
  • 288-pin form factor fits HPE ProLiant ML110 G9 memory slots

Teknik özellikler

BrandNEMIX RAM
SeriesHPE Server/Workstation Compatible Series Memory
ModelHPE DDR4 2666MHZ ECC LRDIMM Load Reduced Server Memory
Part NumberML21300-324K1
Capacity32GB
SpeedDDR4 2666 (PC4 21300)
ECCYes
Buffered/RegisteredLoad Reduced
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemHPE
CAS LatencyCL19
Heat SpreaderNo
Type288-Pin DDR4 LRDIMM
Rank2Rx4
FeaturesDDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible
Package Content32GB (1X32GB) DDR4 2666MHZ PC4-21300 2Rx4 1.2V CL19 288-PIN ECC LRDIMM Load Reduced Server Memory

Bu ürünle ilgili sorular

Should I pick the single 32 GB module or combine smaller sticks for my ML110 G9?

The part ML21300-324K1 is a single 32 GB LRDIMM; adding it alone increases capacity by 32 GB without needing matched pairs.

What does the 2666 MT/s rating deliver inside an HPE ProLiant ML110 G9?

The module runs at DDR4 2666 (PC4-21300) with CL19 latency, giving the server its maximum supported memory bandwidth at 1.2 V.

How does the 288-pin LRDIMM interface affect compatibility with the ML110 G9?

The 288-pin DDR4 LRDIMM form factor with load-reduced buffering is the exact slot type the ML110 G9 requires for ECC memory.

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