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Green printed circuit board with black memory chips, gold edge connectors, no heat spreader

NEMIX RAM

NEMIX RAM 32GB DDR4 2666 ECC LRDIMM CL19 2Rx4 1.2V 288-Pin ML21300-324K1 HPE ML110 G9 memory upgrade

SKU CH-V0J4-F23C5

32 GB DDR4-2666 ECC load-reduced DIMM for HPE ProLiant ML110 G9 servers

  • Capacity32GB
  • SpeedDDR4 2666 (PC4 21300)
  • ECCYes
  • Buffered/RegisteredLoad Reduced
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • 32 GB capacity supports heavy virtualization workloads
  • DDR4 2666 speed delivers high throughput for server applications
  • ECC LRDIMM technology corrects errors to protect data integrity
  • 2 V operation reduces power draw in dense configurations
  • 288-pin form factor fits HPE ProLiant ML110 G9 memory slots

32 GB DDR4 LRDIMM for HPE ML110 G9

This 32 GB DDR4 load-reduced DIMM runs at 2666 MT/s with CL19 latency and operates at 1.2 V. It is built for the HPE ProLiant ML110 G9 server and carries ECC protection for data integrity. The 2Rx4 organisation and 288-pin form factor match the platform’s memory slots exactly.

Load-reduced design limits electrical load

LRDIMM buffering reduces the number of loads presented to the server’s memory controller, allowing higher capacities per channel than standard RDIMMs. The trade-off is slightly higher latency and power draw compared with registered modules at the same speed. Systems must support the LRDIMM protocol; mixing with RDIMM or UDIMM types is not supported.

Major-brand DRAM chips without a heat spreader

Samsung, Micron or Hynix ICs are used depending on supply, all qualified for enterprise workloads. The bare-module design relies on chassis airflow for cooling, so adequate front-to-rear ventilation in the ML110 G9 is required. The 288-pin edge connector keys only into DDR4 LRDIMM slots, preventing accidental insertion into incompatible sockets.

Highlights

  • 32 GB capacity supports heavy virtualization workloads
  • DDR4 2666 speed delivers high throughput for server applications
  • ECC LRDIMM technology corrects errors to protect data integrity
  • 2 V operation reduces power draw in dense configurations
  • 288-pin form factor fits HPE ProLiant ML110 G9 memory slots

Specifications

BrandNEMIX RAM
SeriesHPE Server/Workstation Compatible Series Memory
ModelHPE DDR4 2666MHZ ECC LRDIMM Load Reduced Server Memory
Part NumberML21300-324K1
Capacity32GB
SpeedDDR4 2666 (PC4 21300)
ECCYes
Buffered/RegisteredLoad Reduced
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemHPE
CAS LatencyCL19
Heat SpreaderNo
Type288-Pin DDR4 LRDIMM
Rank2Rx4
FeaturesDDR4 ECC LRDIMM Load Reduced Server Motherboard Compatible
Package Content32GB (1X32GB) DDR4 2666MHZ PC4-21300 2Rx4 1.2V CL19 288-PIN ECC LRDIMM Load Reduced Server Memory

Questions about this item

Should I pick the single 32 GB module or combine smaller sticks for my ML110 G9?

The part ML21300-324K1 is a single 32 GB LRDIMM; adding it alone increases capacity by 32 GB without needing matched pairs.

What does the 2666 MT/s rating deliver inside an HPE ProLiant ML110 G9?

The module runs at DDR4 2666 (PC4-21300) with CL19 latency, giving the server its maximum supported memory bandwidth at 1.2 V.

How does the 288-pin LRDIMM interface affect compatibility with the ML110 G9?

The 288-pin DDR4 LRDIMM form factor with load-reduced buffering is the exact slot type the ML110 G9 requires for ECC memory.

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