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Two gray aluminum heat spreader modules side by side

Team Group

Team Group TLZGD416G3200HC16FDC01 16GB (2 x 8GB) DDR4 3200 desktop RAM

SKU CH-G5WQ-1KPVZ MPN TLZGD416G3200HC16FDC01

A 16 GB DDR4 kit running at 3200 MT/s with CL16 timing and a low-profile aluminium heat spreader

  • Capacity16GB (2 x 8GB)
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL16
  • Timing16-20-20-40
  • Voltage1.35V
  • ECCNo

Capacity 16GB (2 x 8GB)

Speed DDR4 3200 (PC4 25600)

Option 16-20-20-40

  • 16 GB dual-channel kit for smooth multitasking
  • DDR4 3200 speed with CL16 latency for responsive performance
  • 35 V operation reduces power draw and heat
  • Aluminium heat spreader with high-conductivity adhesive for efficient cooling
  • Intel XMP 2.0 profile enables one-click overclocking

Kit configuration

This 16 GB kit contains two 8 GB DDR4 modules rated at 3200 MT/s with CL16 16-20-20-40 timing at 1.35 V. Unbuffered non-ECC design targets mainstream desktop builders who want a simple dual-channel upgrade for Intel or AMD platforms.

Heat spreader and IC selection

A 0.8 mm one-piece aluminum spreader uses high thermal conductive adhesive to move heat from the ICs to the finned surface. Electrolytic anodizing adds corrosion resistance and keeps the spreader non-conductive while the gray finish matches neutral builds.

Installation and XMP

Modules install in standard DIMM slots and run at JEDEC 1.2 V until Intel XMP 2.0 is enabled in the firmware. Most boards apply the 3200 MT/s profile automatically; if the system posts at a lower speed, manually loading the XMP profile resolves it.

Priekšrocības

  • 16 GB dual-channel kit for smooth multitasking
  • DDR4 3200 speed with CL16 latency for responsive performance
  • 35 V operation reduces power draw and heat
  • Aluminium heat spreader with high-conductivity adhesive for efficient cooling
  • Intel XMP 2.0 profile enables one-click overclocking

Specifikācijas

BrandTeam
SeriesT-FORCE VULCAN Z
ModelTLZGD416G3200HC16FDC01
Capacity16GB (2 x 8GB)
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL16
Timing16-20-20-40
Voltage1.35V
ECCNo
Buffered/RegisteredUnbuffered
BIOS/Performance ProfileIntel XMP 2.0
ColorGray
Heat SpreaderAluminum
FeaturesSimple design to perfectly protect the cooling module
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC
Supports XMP2.0
Energy saving with ultra-low working voltage
Sūtījuma svars0.14 kg
Sūtījuma izmēri168 × 104 × 36 mm

Citas šī modeļa versijas

Vēl 4 šajā sērijā

Viena saime, taču atšķirīga atmiņa, dzesētājs vai frekvence — salīdziniet, pirms izlemjat.

Jautājumi par šo preci

Will the 0.8 mm aluminum heat spreader need any cleaning or re-pasting over time?

The spreader is a single-piece alloy with anodized finish and high-conductivity adhesive pre-applied; no user maintenance is required.

What timing ceiling appears first when the CL16 16-20-20-40 kit runs at 3200 MT/s for hours?

The CAS latency of 16 and the tRAS of 40 cycles are the primary limits under sustained load at the rated speed.

How much heat and power does the 1.35 V dual-channel kit produce during all-day operation?

At the rated 1.35 V the modules draw minimal power and the aluminum spreader with conductive adhesive keeps temperatures low during continuous use.

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