BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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Corsair
A 16 GB DDR4 kit with two 8 GB modules running at 3200 MHz CL16, featuring a low-profile aluminium heatspreader and Intel XMP 2.0 support
This Corsair Vengeance LPX kit provides 16 GB of DDR4 memory across two 8 GB modules running at 3200 MT/s with a CL16 latency of 16-18-18-36. It targets enthusiasts who want reliable overclocking headroom on Intel 200, 300, 400, 500 and X299 platforms or AMD 300, 400, 500 and X570 platforms. The 1.35 V operating voltage and Intel XMP 2.0 profile simplify high-speed configuration.
Each module uses a pure aluminum heatspreader in red that draws heat away from the individually screened ICs. The eight-layer PCB further assists thermal management during sustained loads. A low-profile form factor clears oversized CPU coolers and fits compact chassis without interfering with fan placement. The 288-pin unbuffered DIMM layout ensures standard desktop compatibility.
The factory-programmed XMP 2.0 profile lets the motherboard set the rated 3200 MT/s speed and timings with a single BIOS selection. Every IC is screened for overclocking potential, giving builders confidence when pushing frequencies beyond the rated specification. No additional software installation is required; the profile is stored on the module SPD.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK16GX4M2B3200C16R |
| Capacity | 16GB (2 x 8GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL16 |
| Timing | 16-18-18-36 |
| Voltage | 1.35V |
| Buffered/Registered | Unbuffered |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Red |
| Heat Spreader | Anodized Aluminum |
| Features | Designed for high-performance overclocking Designed for great looks Performance and Compatibility Low-profile heatspreader design |
| Recommend Use | AMD 300 Series / AMD 400 Series / AMD X570 / Intel 200 Series / Intel 300 Series / Intel 400 Series / Intel X299 / AMD 500 Series / Intel 500 Series |
| Berat penghantaran | 0.11 kg |
| Dimensi bungkusan | 155 × 92 × 13 mm |
The DDR4 3200 (PC4 25600) rating gives a peak transfer rate of 25 600 MB/s per module when the XMP 2.0 profile is enabled in the BIOS.
The anodized aluminum heatspreader uses a low-profile design that sits close to the PCB, leaving extra room for oversized coolers that overhang the first DIMM slot.
Enable the Intel XMP 2.0 profile in the motherboard BIOS; without it the kit will run at the standard JEDEC frequency and looser timings.
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