BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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Corsair
16 GB dual-channel DDR4 kit rated at 3600 MT/s CL16 with a 34 mm low-profile aluminum heatspreader for compact builds
This 16GB kit contains two 8GB DDR4 modules rated at 3600 MT/s with CL16 timings. Hand-sorted chips provide generous overclocking headroom for enthusiasts and gamers. The anodized aluminum heat spreader keeps temperatures low during extended sessions. Intel XMP 2.0 support enables one-click configuration on compatible platforms.
The solid aluminum heat spreader efficiently dissipates heat so modules consistently run at high clock speeds. A high-performance PCB guarantees strong signal quality and stability under prolonged workloads. Hand-sorted chips maintain tight timings without throttling during long rendering or gaming sessions. Low 1.35V operation reduces thermal output compared to higher-voltage alternatives.
At just 34mm tall the modules fit most small-form-factor builds and clear large CPU coolers. The 288-pin DDR4 form factor seats in standard desktop slots without force. Intel XMP 2.0 applies rated speed and 16-19-19-36 timings automatically in BIOS. If XMP is unavailable the kit defaults to standard JEDEC speeds until manually configured.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK16GX4M2D3600C16 |
| Capacity | 16GB (2 x 8GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3600 (PC4 28800) |
| CAS Latency | CL16 |
| Timing | 16-19-19-36 |
| Voltage | 1.35V |
| ECC | No |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Black |
| Heat Spreader | Anodized Aluminum |
| Features | Hand-sorted memory chips ensure high performance with generous overclocking headroom. VENGEANCE LPX is optimized for wide compatibility with the latest Intel and AMD DDR4 motherboards. A low-profile height of just 34mm ensures that VENGEANCE LPX even fits in most small-form-factor builds. A high-performance PCB guarantees strong signal quality and stability for superior overclocking ability. A solid aluminum heatspreader efficiently dissipates heat from each module so that they consistently run at high clock speeds. Supports Intel XMP 2.0 for simple one-setting installation and setup |
| Recommend Use | AMD B550 / AMD X570 / Intel 300 Series / Intel 400 Series |
| Berat penghantaran | 0.10 kg |
| Dimensi bungkusan | 154 × 90 × 10 mm |
The solid aluminum heatspreader efficiently dissipates heat so the modules consistently run at high clock speeds.
A 288‑pin DDR4 slot and Intel XMP 2.0 support in the BIOS are required to load the 16‑19‑19‑36 profile at 1.35 V.
At 34 mm tall the kit fits most small‑form‑factor cases and leaves room for oversized CPU coolers.
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