BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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G.SKILL
Dual-channel 32 GB DDR5 kit at 6000 MT/s with CL28 timing, 1.40 V operation and AMD EXPO support for Ryzen 7000 and 9000 series builds
This 32 GB dual-channel kit uses two 16 GB DDR5 modules rated at 6000 MT/s with CL28 28-36-36-96 timings at 1.40 V. It targets AMD Ryzen 7000 and 9000 series systems and carries AMD EXPO profiles for one-click configuration on compatible 600, 800, B650, X570, X670 and X870 platforms.
The white aluminium heat spreader dissipates heat from the hand-screened ICs while keeping module height at 33 mm for clearance under large coolers. Operating at the rated 1.40 V the kit runs within standard DDR5 power limits and produces no audible noise because it has no moving parts.
Each stick uses the standard 288-pin DDR5 edge connector and the reduced 33 mm height avoids interference with oversized CPU coolers in compact cases. The white finish matches light-themed builds and the unbuffered, non-ECC design suits consumer desktop boards without requiring registered DIMM support.
| Brand | G.SKILL |
|---|---|
| Series | Flare X5 |
| Model | F5-6000J2836G16GX2-FX5W |
| Capacity | 32GB (2 x 16GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL28 |
| Timing | 28-36-36-96 |
| Voltage | 1.40V |
| ECC | No |
| Buffered/Registered | Unbuffered / Unregistered |
| Multi-channel Kit | Dual Channel Kit |
| BIOS/Performance Profile | AMD EXPO |
| Color | White |
| Heat Spreader | Yes |
| Features | Flare X5 series is a low-profile DDR5 memory designed for high performance on compatible DDR5-enabled AMD platforms, and supports AMD EXPO overclocking profiles to enable easy memory overclocking by simply enabling the EXPO profile in the BIOS with a compatible motherboard and processor. Featuring a 33mm low-profile height and built with hand-screened IC chips, the Flare X5 is an excellent choice for compact performance PC builds. • Optimized for AMD Ryzen 7000/9000 series processors or later • 33mm Low-profile module height design • AMD EXPO Support |
| Recommend Use | AMD 600 Series / AMD 800 Series / AMD B650 / AMD Ryzen Compatible / AMD X570 / AMD X670 / AMD X870 / High Performance or Gaming Memory |
| LED Color | None |
| Berat penghantaran | 0.09 kg |
| Dimensi bungkusan | 220 × 146 × 13 mm |
Align the notch on each 16 GB stick with the motherboard slot key, press down firmly until both side clips click, then enable the AMD EXPO profile in BIOS so the kit runs at its rated DDR5-6000 CL28 1.40 V settings instead of staying at JEDEC defaults.
The white aluminium heat spreader requires only occasional dust removal with compressed air; the unbuffered non-ECC ICs have no user-serviceable parts, so replacement is only necessary if a module fails or a capacity upgrade is desired.
The 1.40 V operating voltage and 33 mm low-profile spreader mean thermal headroom is the first constraint; prolonged loads can push module temperatures high enough to trigger throttling before the CL28-36-36-96 timings become unstable.
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