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Grey thermal paste syringe 1.5g with applicator tool

Lirealar

Lirealar TF4 Thermal Paste 9.5 W/mK 1.5g

SKU CH-0XWS-8R49P MPN TF4

Carbon-based compound rated at 9.5 W/mK fills CPU or GPU gaps without conducting electricity and lasts six years

  • Volume / Net Weight1.5g
  • Thermal Conductivity9.5 W/mK,
  • Long Term Operating Temperature-50~240°C
  • SpecificationsColor:Gray Thermal resistance:<0.0068(°C-CM²/W) Density:2.7(
  • FeaturesHigh Thermal Conductivity 9.5 W/mK Non-Elecnical Conducive N

Type Thermal Paste

Model TF4

Versi yang dicoret wujud, tetapi tidak tersedia di sini.

Specification 1.5g

Lihat 1 konfigurasi lagi
  • High thermal conductivity of 9.5 W/mK moves heat quickly from CPU or GPU
  • Non-electrically conductive carbon formula eliminates short-circuit risk on sensitive components
  • Stable from -50 °C to 240 °C for reliable performance in extreme conditions
  • Non-corrosive, non-curing and non-toxic paste stays effective for at least six years
  • 5 g syringe with included tool makes precise application easy even for beginners

Carbon-based thermal compound for CPUs and GPUs

Lirealar TF4 is a carbon-based thermal paste rated at 9.5 W/mK thermal conductivity. The 1.5 g syringe targets desktop and laptop builders who need to bridge the CPU or GPU die to a heatsink. Non-electrically conductive and non-corrosive, it eliminates short-circuit risk while remaining stable from -50 °C to 240 °C. The grey compound resists curing and is rated to last at least six years.

Suitable for standard desktop and laptop maintenance

The paste suits hobbyists and technicians performing routine CPU, GPU or LED cooler installations where electrical safety and long-term stability are priorities. Builders who need larger volumes for multiple systems or repeated re-pasting should consider bulk alternatives. The single 1.5 g syringe covers one typical application but does not support high-volume workshop use.

Thermal conductivity of 9.5 W/mK

The 9.5 W/mK rating is the decisive figure that determines whether TF4 meets a specific cooling requirement. It governs how efficiently heat moves from the die to the cooler base and directly affects achievable temperatures under load. Verify that this conductivity value matches the thermal design envelope of the target processor or graphics card before purchase.

Ciri-ciri utama

  • High thermal conductivity of 9.5 W/mK moves heat quickly from CPU or GPU
  • Non-electrically conductive carbon formula eliminates short-circuit risk on sensitive components
  • Stable from -50 °C to 240 °C for reliable performance in extreme conditions
  • Non-corrosive, non-curing and non-toxic paste stays effective for at least six years
  • 5 g syringe with included tool makes precise application easy even for beginners

Spesifikasi

SeriesThermal Paste
ModelTF4 Thermal Compound Paste
Volume / Net Weight1.5g
Thermal Conductivity9.5 W/mK,
Long Term Operating Temperature-50~240°C
SpecificationsColor:Gray Thermal resistance:<0.0068(°C-CM²/W) Density:2.7(25°C) Operating temperature:-50~240°C Electrical conductivity:NO Harmless:YES Content: 1g 2Pcs
FeaturesHigh Thermal Conductivity 9.5 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years

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Will the 9.5 W/mK TF4 paste work with an older cooler that has a slightly uneven base?

Yes, the TF4's ideal consistency fills microscopic gaps on uneven cooler bases, and its 9.5 W/mK conductivity ensures efficient heat transfer from CPU or GPU.

How can I verify the TF4 paste is applied correctly after installation?

Check that CPU or GPU temperatures under load remain stable and within expected ranges; the non-curing formula maintains performance without drying out.

Does the 1.5g syringe include a spreading tool or must I buy one separately?

The package includes one syringe and a tool for application; no separate purchase is needed for standard CPU or GPU installation.

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