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Grey thermal paste syringe 5.8 g with applicator tool

Lirealar

Lirealar TF8 Thermal Paste 13.8 W/mK 5.8g

SKU CH-PNEQ-1HZE7 MPN TF8

Carbon-based thermal compound with 13.8 W/mK conductivity, non-conductive and non-corrosive, supplied in a 5.8 g syringe with application tool

  • Volume / Net Weight5.8g
  • Thermal Conductivity13.8 W/mK,
  • Long Term Operating Temperature-220~380°C
  • SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25
  • FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive

Type Thermal Paste

Model TF8

Versi yang dicoret wujud, tetapi tidak tersedia di sini.

Specification 5.8g

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  • High thermal conductivity 13.8 W/mK moves heat fast from CPU or GPU
  • Non-electrically conductive carbon formula prevents short circuits on sensitive components
  • Non-corrosive and non-curing compound stays effective for at least six years
  • Easy-application consistency fills microscopic gaps between die and cooler without voids
  • Wide operating range from -220 °C to 380 °C suits extreme cooling setups

Carbon-Based Thermal Paste

Lirealar TF8 is a carbon-based thermal compound rated at 13.8 W/mK for desktop and laptop CPU, GPU and LED coolers. The 5.8 g syringe targets builders who want a non-electrically-conductive paste that remains stable across extreme temperatures. It is not suited for users who need a larger volume for multiple system builds or industrial-scale applications.

Wide Operating Range

The compound operates from -220 °C to 380 °C with thermal resistance below 0.01 °C·cm²/W and density of 2.9 g/cm³ at 25 °C. Being non-curing and non-corrosive, it maintains consistent thermal transfer without hardening or degrading, keeping cooler noise and power draw unaffected over time.

Spreader Tool Included

A spreader tool ships with the syringe to help achieve an even layer and minimise air gaps during application. The paste is non-toxic and designed to last at least six years without re-application, reducing maintenance effort for the installed hardware.

Ciri-ciri utama

  • High thermal conductivity 13.8 W/mK moves heat fast from CPU or GPU
  • Non-electrically conductive carbon formula prevents short circuits on sensitive components
  • Non-corrosive and non-curing compound stays effective for at least six years
  • Easy-application consistency fills microscopic gaps between die and cooler without voids
  • Wide operating range from -220 °C to 380 °C suits extreme cooling setups

Spesifikasi

SeriesThermal Paste
ModelTF8 Thermal Compound Paste
Volume / Net Weight5.8g
Thermal Conductivity13.8 W/mK,
Long Term Operating Temperature-220~380°C
SpecificationsColor:Gray Thermal resistance:<0.01(°C-CM²/W) Density:2.9(25°C) Operating temperature:-220~380°C Electrical conductivity:NO Harmless:YES Content: 12.8g
FeaturesHigh Thermal Conductivity 13.8 W/mK Non-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi lnsulation does not conduct electricity and is safe for use It will last At least for 6 years

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Soalan tentang produk ini

How do I apply the TF8 paste with the included tool and what step do beginners often miss?

Spread a thin, even layer using the supplied applicator; the step many skip is cleaning both CPU and cooler surfaces completely before application.

Will the 5.8 g syringe need replacing and after how long?

The compound is rated to last at least six years without curing or degrading, so replacement is not expected within that period.

At what temperature does the paste hit its operating limit during heavy loads?

The long-term operating range tops out at 380 °C, which is the first thermal boundary reached under sustained use.

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