BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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NEMIX RAM
An 8 GB DDR4 laptop memory kit running at 2666 MHz with CL19 latency and 1.20 V operation
This 8 GB kit contains two 4 GB DDR4 SODIMM modules rated at 2666 MT/s with CL19 latency. It is intended for laptops, all-in-one PCs, small-form-factor systems and NAS devices that accept 260-pin unbuffered non-ECC memory. The kit suits owners who need a straightforward capacity increase for everyday workloads.
Each module runs at the standard 1.20 V, so power draw and heat output remain modest during typical office or browsing tasks. Without a heat spreader the sticks rely on the host chassis for airflow, keeping acoustic impact negligible in normal use.
Modules are stress-tested under load to verify stability during prolonged workloads such as large file transfers or extended virtualisation sessions. The unbuffered design and CL19 timing deliver consistent throughput without the higher voltages that would increase thermals over time. Buyers needing ECC error correction or registered buffering for mission-critical servers should look elsewhere.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM DDR4 Orignial Series 260-Pin NON-ECC Unbuffered SODIMM Memory |
| Model | DDR4 NON-ECC Unbuffered SODIMM Laptop, AIO, SFF, NAS Storage Device Memory |
| Part Number | MS21300-418K2 |
| Capacity | 8GB (2 x 4GB) |
| Type | 260-Pin DDR4 SO-DIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.20V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Heat Spreader | No |
| Features | DDR4 Laptop, AIO All-in-One, SFF, NAS Device Compatible |
Power off the laptop, open the memory compartment, insert each 260-pin module at an angle until the gold contacts are hidden, then press down firmly until both side clips click — the click is the step many skip.
No scheduled maintenance is required; the modules have no heat spreader and no moving parts, so they run until a system upgrade demands higher capacity or a faster DDR4 speed.
The CL19 timing at 2666 MT/s sets the latency floor; under continuous heavy workloads the CAS latency becomes the bottleneck before voltage or thermal constraints.
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