BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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RIMLANCE
A 16 GB DDR3 SODIMM kit (2 × 8 GB) running at 1600 MHz with CL11 latency and 1.5 V operation
The RIMLANCE kit provides 16GB of DDR3 laptop memory across two 8GB modules. It uses the 204-pin SODIMM form factor and runs at 1600MHz with a CAS latency of 11. The modules are unbuffered, non-ECC and operate at the standard 1.5V for this generation. They suit notebooks that accept DDR3 SO-DIMMs and need a straightforward capacity increase.
Operating at 1.5V, the modules draw the standard voltage for DDR3 SODIMMs. No additional cooling is required beyond the laptop's existing thermal solution. The unbuffered design keeps electrical load on the memory controller low. Power consumption scales with workload but remains within the limits defined by the DDR3 SODIMM specification for this voltage.
Installation uses the standard SODIMM slot; no tools or configuration changes are needed beyond seating the modules. The kit frees the single-slot alternative for other upgrades or leaves a slot open on four-slot boards. It does not support ECC or registered operation, so it is not suited to workstations that require those features. Ensure the notebook chipset accepts 8GB density per module.
| Brand | RIMLANCE |
|---|---|
| Model | RSO12800D8C2K16 |
| Capacity | 16GB (2 x 8GB) |
| Type | 204-Pin DDR3 SO-DIMM |
| CAS Latency | CL11 |
| ECC | No |
| Buffered/Registered | Unbuffered |
Power off the laptop, remove the battery if accessible, open the memory compartment, align the notch on each module with the slot key, press firmly until the side clips click, then replace the cover and battery before turning on.
No routine maintenance is required; the unbuffered non-ECC modules have no moving parts or firmware, so replacement is only necessary if a module fails or the laptop is upgraded to a platform that uses a different memory generation.
The CAS latency of 11 cycles at 1600MHz sets the baseline response time; under heavy sustained workloads the memory controller's throughput ceiling is reached before the modules themselves become a bottleneck.
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