BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
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SK hynix
32GB kit of four 8GB DDR4-2933 CL21 1Rx8 ECC registered DIMMs for servers
This 32GB kit contains four 8GB DDR4-2933 registered DIMMs with ECC and CL21 latency. It is built for servers and workstations that require error correction and signal integrity under sustained loads. The modules operate at 1.20V and conform to the PC4-23400 standard. Desktop boards that cannot use registered ECC memory will not accept these sticks.
Each module runs at the standard DDR4 voltage of 1.20V, keeping power draw low for high-density server configurations. Registered buffering reduces electrical load on the memory controller, which helps thermal stability in fully populated slots. No active cooling is included; airflow across the 31.25mm module height is expected from the chassis design. Acoustic impact is negligible because the DIMMs have no moving parts.
The registered design adds a register between the DRAM and the memory controller, enabling parity checking that detects improper addresses or commands. ECC corrects single-bit errors and detects multi-bit errors to protect data integrity in critical workloads. These features replace the need for non-ECC consumer modules in supported platforms. No software utilities or additional accessories are bundled with the kit.
| Brand | SK hynix |
|---|---|
| Model | HMA81GR7CJR8N-WM |
| Capacity | 32GB (4 x 8GB) |
| Type | 288-Pin DDR4 SDRAM |
| Speed | DDR4 2933 (PC4 23400) |
| CAS Latency | CL21 |
| Voltage | 1.20V |
| ECC | Yes |
| Buffered/Registered | Registered |
Align the notch on each module with the slot key, press firmly until both retention clips click, and ensure the registered buffer engages — skipping the clip check is the common error.
No routine maintenance is required; replace a module only if the system logs uncorrectable ECC errors or a DIMM fails POST testing.
The registered buffer and CL21 latency set the throughput ceiling before thermal or voltage limits become a factor.
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