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Thermal Grizzly

Thermal Grizzly Hydronaut TG-H-030-R 1.0g thermal paste

SKU CH-4FSH-S8B9P

High-performance thermal compound with 11.8 W/mK conductivity, non-conductive and silicone-free for CPUs, GPUs and consoles

  • Volume / Net Weight1.0g
  • Thermal Conductivity11.8 W/Mk
  • Specifications7.8 grams
  • FeaturesHydronaut can be used for overclocking due to it's excellent

Weight 7.8 g

  • High thermal conductivity of 11.8 W/Mk enables efficient heat transfer
  • Non-conductive formula with 0 pS/m eliminates short-circuit risk
  • Syringe delivery allows precise application on CPU and GPU
  • Stable from -200 °C to +350 °C for extreme cooling setups
  • Silicone-free compound resists hardening for long-term reliability

Purpose & Audience

Thermal Grizzly Hydronaut TG-H-030-R is a 1.0g syringe of high-performance thermal compound. It is built for enthusiasts who need reliable heat transfer on CPUs, GPUs, laptops or consoles such as PS5 and Xbox Series X. The paste suits both air and water-cooling setups where consistent thermal resistance matters.

Who It Suits & Who It Does Not

This compound works well for builders who want a non-conductive, silicone-free paste that will not cure or harden over time. It is not suited for users who require a larger volume than 1.0g for multiple applications or for those who need an electrically conductive interface material.

Deciding Specification

Thermal conductivity is rated at 11.8 W/Mk with a thermal resistance of 0.0076 K/W. The operating range spans -200 °C to +350 °C and viscosity sits at 140-190 Pas. These figures determine whether the paste meets the thermal load of your specific cooler and component.

Ciri-ciri utama

  • High thermal conductivity of 11.8 W/Mk enables efficient heat transfer
  • Non-conductive formula with 0 pS/m eliminates short-circuit risk
  • Syringe delivery allows precise application on CPU and GPU
  • Stable from -200 °C to +350 °C for extreme cooling setups
  • Silicone-free compound resists hardening for long-term reliability

Spesifikasi

BrandThermal Grizzly
SeriesHydronaut
ModelTG-H-030-R
Part NumberTG-H-030-R
Volume / Net Weight1.0g
Thermal Conductivity11.8 W/Mk
Specifications7.8 grams
FeaturesHydronaut can be used for overclocking due to it's excellent thermal conductivity.

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Will the 11.8 W/Mk thermal conductivity work well with an older aluminium heatsink I plan to keep?

Yes, Hydronaut is compatible with all heatsink materials including aluminium and copper, and its 11.8 W/Mk conductivity suits both air and water cooling systems.

How can I verify the paste is performing correctly after applying it to my CPU?

Monitor CPU temperatures under load; the low 0.0076 K/W thermal resistance and non-curing formula mean stable temps should appear immediately and remain consistent over time.

Does the 1.0 g syringe include a spreader or do I need to buy one separately?

The syringe dispenses paste directly onto the die; no spreader is included, but the 140-190 Pas viscosity lets you apply a thin line or dot that spreads evenly under mounting pressure.

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