Thermal Grizzly Hydronaut TG-H-015-R thermal paste 1.0g
- 1.0g
- 11.8 W/Mk
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Thermal Grizzly
High-performance thermal compound with 11.8 W/mK conductivity, non-conductive and silicone-free for CPUs, GPUs and consoles
Thermal Grizzly Hydronaut TG-H-030-R is a 1.0g syringe of high-performance thermal compound. It is built for enthusiasts who need reliable heat transfer on CPUs, GPUs, laptops or consoles such as PS5 and Xbox Series X. The paste suits both air and water-cooling setups where consistent thermal resistance matters.
This compound works well for builders who want a non-conductive, silicone-free paste that will not cure or harden over time. It is not suited for users who require a larger volume than 1.0g for multiple applications or for those who need an electrically conductive interface material.
Thermal conductivity is rated at 11.8 W/Mk with a thermal resistance of 0.0076 K/W. The operating range spans -200 °C to +350 °C and viscosity sits at 140-190 Pas. These figures determine whether the paste meets the thermal load of your specific cooler and component.
| Brand | Thermal Grizzly |
|---|---|
| Series | Hydronaut |
| Model | TG-H-030-R |
| Part Number | TG-H-030-R |
| Volume / Net Weight | 1.0g |
| Thermal Conductivity | 11.8 W/Mk |
| Specifications | 7.8 grams |
| Features | Hydronaut can be used for overclocking due to it's excellent thermal conductivity. |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Yes, Hydronaut is compatible with all heatsink materials including aluminium and copper, and its 11.8 W/Mk conductivity suits both air and water cooling systems.
Monitor CPU temperatures under load; the low 0.0076 K/W thermal resistance and non-curing formula mean stable temps should appear immediately and remain consistent over time.
The syringe dispenses paste directly onto the die; no spreader is included, but the 140-190 Pas viscosity lets you apply a thin line or dot that spreads evenly under mounting pressure.
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