UPSIREN
UPSIREN OEM 18W/mk Thermal Pad 100x100x1.5mm 23g
High-conductivity 18 W/mK silicone pad sized 100×100×1.5 mm, non-conductive and reusable for CPU, GPU or LED cooling
- Volume / Net Weight23g
- Thermal Conductivity18W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 1.5 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- High 18 W/mK conductivity moves heat fast from CPU or GPU
- 100 × 100 × 1.5 mm pad covers large heatsink surfaces in one piece
- Non-conductive silicone prevents shorts on dense PCB layouts
- Soft 30-degree shore material compresses to fill microscopic gaps without pressure damage
- Stable from -40 °C to 200 °C for reliable long-term operation
UPSIREN OEM 18W/mk Thermal Pad
The UPSIREN OEM thermal pad measures 100 by 100 by 1.5 mm and weighs 23 g. It provides 18 W/mk thermal conductivity for CPU, GPU, laptop heatsink or LED cooler applications. The silicone material is non-conductive, non-corrosive, non-curing and non-toxic. Buyers needing a liquid compound or a different thickness will not find it here.
Installation and common issues
Natural viscosity lets the pad conform to surfaces with light pressure and it can be reused if removed carefully. The material hardness is 30 degrees, so it compresses to fill gaps without excessive force. Take care not to tear the soft silicone when positioning it around tall components or sharp edges. No curing time is required before reassembly.
Sustained-load behaviour
Rated for continuous operation from minus 40 to 200 °C, the pad will not melt or degrade during prolonged high-temperature use. It maintains insulation and thermal transfer across the full range without drying out. The pad suits long-term deployments in industrial, automotive or consumer electronics where consistent heat dissipation is required.
Ciri-ciri utama
- High 18 W/mK conductivity moves heat fast from CPU or GPU
- 100 × 100 × 1.5 mm pad covers large heatsink surfaces in one piece
- Non-conductive silicone prevents shorts on dense PCB layouts
- Soft 30-degree shore material compresses to fill microscopic gaps without pressure damage
- Stable from -40 °C to 200 °C for reliable long-term operation
Spesifikasi
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 18W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 18W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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How can I confirm the pad is performing correctly once installed?
After fitting the 100x100x1.5mm pad between the chip and heatsink, monitor component temperatures under load; a measurable drop indicates the 18W/mk conductivity is transferring heat as intended across the full operating range of -40 to 200 C.
What comes in the package and do I need anything else?
The box contains one 23g silicone thermal pad measuring 100x100x1.5mm; no additional compound, adhesive or tools are required because the material has natural viscosity and is reusable.
Which thickness should I select for my GPU or laptop heatsink gap?
Choose the 1.5mm version when the gap between the die and cooler matches that dimension; the pad compresses to a 30-degree hardness for close contact without electrical conduction.
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