Aceitamos criptomoeda — para que as moedas que detém possam comprar material informático real.Pague em cripto, gaste-a em material informático real. Envio seguro gratuito para todo o mundo acima de 399 $. Caixas neutras, sem marca, expedidas a partir da Alemanha.Envio seguro gratuito acima de 399 $. A sua taxa fica bloqueada durante 30 minutos assim que abre a finalização da compra.Taxa bloqueada 30 minutos. Cada artigo é selado, o seu número de série é verificado, e está coberto por uma garantia de 24 meses.Selado, garantido 24 meses.

Artigos guardados Iniciar sessão

UPSIREN

UPSIREN OEM 18W/mk Thermal Pad 100x100x1.5mm 23g

SKU CH-S21M-PY9TG

High-conductivity 18 W/mK silicone pad sized 100×100×1.5 mm, non-conductive and reusable for CPU, GPU or LED cooling

  • Volume / Net Weight23g
  • Thermal Conductivity18W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi
  • High 18 W/mK conductivity moves heat fast from CPU or GPU
  • 100 × 100 × 1.5 mm pad covers large heatsink surfaces in one piece
  • Non-conductive silicone prevents shorts on dense PCB layouts
  • Soft 30-degree shore material compresses to fill microscopic gaps without pressure damage
  • Stable from -40 °C to 200 °C for reliable long-term operation

UPSIREN OEM 18W/mk Thermal Pad

The UPSIREN OEM thermal pad measures 100 by 100 by 1.5 mm and weighs 23 g. It provides 18 W/mk thermal conductivity for CPU, GPU, laptop heatsink or LED cooler applications. The silicone material is non-conductive, non-corrosive, non-curing and non-toxic. Buyers needing a liquid compound or a different thickness will not find it here.

Installation and common issues

Natural viscosity lets the pad conform to surfaces with light pressure and it can be reused if removed carefully. The material hardness is 30 degrees, so it compresses to fill gaps without excessive force. Take care not to tear the soft silicone when positioning it around tall components or sharp edges. No curing time is required before reassembly.

Sustained-load behaviour

Rated for continuous operation from minus 40 to 200 °C, the pad will not melt or degrade during prolonged high-temperature use. It maintains insulation and thermal transfer across the full range without drying out. The pad suits long-term deployments in industrial, automotive or consumer electronics where consistent heat dissipation is required.

Pontos fortes

  • High 18 W/mK conductivity moves heat fast from CPU or GPU
  • 100 × 100 × 1.5 mm pad covers large heatsink surfaces in one piece
  • Non-conductive silicone prevents shorts on dense PCB layouts
  • Soft 30-degree shore material compresses to fill microscopic gaps without pressure damage
  • Stable from -40 °C to 200 °C for reliable long-term operation

Especificações

BrandUPSIREN
SeriesOEM
Model18W
Volume / Net Weight23g
Thermal Conductivity18W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Outras versões deste modelo

Mais 5 nesta gama

Mesma família, memória, ventoinha ou frequência diferentes — compare antes de decidir.

Perguntas sobre este artigo

How can I confirm the pad is performing correctly once installed?

After fitting the 100x100x1.5mm pad between the chip and heatsink, monitor component temperatures under load; a measurable drop indicates the 18W/mk conductivity is transferring heat as intended across the full operating range of -40 to 200 C.

What comes in the package and do I need anything else?

The box contains one 23g silicone thermal pad measuring 100x100x1.5mm; no additional compound, adhesive or tools are required because the material has natural viscosity and is reusable.

Which thickness should I select for my GPU or laptop heatsink gap?

Choose the 1.5mm version when the gap between the die and cooler matches that dimension; the pad compresses to a 30-degree hardness for close contact without electrical conduction.

Também nesta secção

Os clientes também compararam

Mesma prateleira, mesma finalização da compra — oito moedas e uma taxa bloqueada durante 30 minutos.