NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
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AMD
A 16-core, 32-thread server CPU running at 2.4 GHz with 64 MB L3 cache, DDR4-3200 support across eight channels and 128 PCIe 4.0 lanes
The AMD EPYC 7303 delivers 16 cores and 32 threads for multi-threaded server workloads. It operates at a 2.4 GHz base frequency with a 3.4 GHz maximum turbo boost. The processor fits the Socket SP3 platform and provides 128 PCI Express 4.0 lanes for high-bandwidth I/O. It targets data centres that need dense compute within a 130 W thermal envelope.
The processor carries a 130 W thermal design power rating for sustained workloads. No cooling device is included in the package, so a compatible SP3 heatsink or liquid block must be sourced separately. The 7 nm process technology helps maintain efficiency at the rated power level. Actual power consumption and noise depend entirely on the chosen cooling solution and chassis airflow.
The product ships as an OEM processor only, without a stock cooler or mounting hardware. System integrators must supply a qualified SP3 cooling solution to meet the 130 W thermal requirement. AMD Infinity Guard security features are built into the silicon, including Secure Encrypted Virtualization for virtual machine isolation. These features function without additional software licences once the platform firmware enables them.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7003 |
| Name | EPYC 7303 |
| Model | 100-000001288 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 16-Core |
| # of Threads | 32 |
| Operating Frequency | 2.4 GHz |
| Max Turbo Frequency | 3.4 GHz |
| L3 Cache | 64MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 130W |
| Cooling Device | Cooling device not included - Processor Only |
| Fraktvekt | 2.27 kg |
| Pakkestørrelse | 25 × 25 × 25 mm |
Place the processor into the SP3 socket without soldering, then apply fresh thermal interface material before mounting the cooler because no cooling device is included.
The processor has no user-serviceable parts; only the external cooler and its thermal paste require periodic inspection and replacement.
The 130 W thermal design power becomes the constraining factor, so the cooling solution must dissipate that heat continuously.
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