NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
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AMD
64-core server processor with 2.0 GHz base clock, 3.35 GHz boost, 256 MB L3 cache, eight-channel DDR4-3200 support and 128 PCIe 4.0 lanes
The AMD EPYC 7702 is a 64-core, 128-thread server processor built on 7 nm process technology. It targets data-centre operators who need maximum thread density for virtualisation, cloud workloads and high-performance computing. The OEM package contains the processor only.
This CPU requires a Socket SP3 platform and delivers 128 lanes of PCI Express 4.0 connectivity. The eight-channel DDR4-3200 memory controller supports large memory footprints. A 200 W thermal design power demands adequate cooling infrastructure, which is not included.
The processor ships without a cooling device, so integrators must supply a compatible SP3 heatsink or liquid block. No management software or licence keys are included in the package. Buyers who need a pre-applied thermal solution or bundled orchestration tools should look elsewhere.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7702 |
| Model | 100-000000038 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 64-Core |
| # of Threads | 128 |
| Operating Frequency | 2.0 GHz |
| Max Turbo Frequency | 3.35 GHz |
| L3 Cache | 256MB |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 200W |
| Cooling Device | Cooling device not included - Processor Only |
| Fraktvekt | 1.97 kg |
| Pakkestørrelse | 203 × 127 × 76 mm |
The 64 cores and 128 threads allow the processor to handle many virtual machines, containers or high-performance computing tasks simultaneously, improving throughput for heavily parallel workloads.
PCIe 4.0 provides double the bandwidth per lane of the previous generation, and 128 lanes give ample connectivity for multiple GPUs, high-speed storage arrays and network adapters without bottlenecks.
The chip uses the SP3 socket and has a 200 W TDP; a compatible server board and a cooling solution rated for at least 200 W are required, as no cooler is included.
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