Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
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Dynatron
Active air cooler with aluminium stacked fins and heat pipes handles 225 W TDP for AMD EPYC SP6 CPUs in 3U servers
The Dynatron A55 is an active air cooler built for AMD EPYC processors using the SP6 socket. It fits 3U server chassis and workstations where a low-profile thermal solution is required. The unit handles a thermal design power of up to 225 Watts. Buyers needing coolers for other socket types or taller rack heights should look elsewhere.
Verify that your chassis provides enough height for a 3U form factor and that the motherboard layout matches the SP6 mounting pattern. Confirm the fan header on your board supplies a standard 4-pin PWM signal for speed control. The aluminium stacked-fin array with embedded heatpipes requires unobstructed airflow through the rack. Systems lacking these physical or electrical provisions cannot use this cooler.
A dual ball-bearing fan regulated by 4-pin PWM adjusts speed to match load, keeping the EPYC CPU within its thermal envelope at 225 W TDP. The aluminium heatsink and heatpipe construction moves heat away from the die efficiently during sustained workloads. Ball bearings reduce wear compared with sleeve designs, supporting continuous operation in server environments. Noise level varies with fan duty cycle under PWM control.
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The Dynatron A55 is designed for AMD SP6 sockets and includes the necessary mounting hardware for installation on compatible EPYC processors.
This A55 model is rated for up to 225 W TDP, making it the correct choice for EPYC processors operating at that thermal limit.
The 225 W rating indicates the cooler can dissipate that thermal load using its aluminum stacked fin array, embedded heatpipes and PWM-controlled fan within a 3U form factor.
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