NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
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Micro Connectors
Aluminum case with heat sinks fits Raspberry Pi 1 B+, Pi 2 B and Pi 3 B/B+ and includes wall-mount option
The Micro Connectors RAS-PCS03-SL is an aluminium case designed for Raspberry Pi 1 Model B+, Pi 2 Model B and Pi 3 Model B/B+ boards. It provides passive cooling through the metal body and included heat-sink kits. The silver finish gives a clean look for desktop or embedded projects.
Precision-cut openings give direct access to every port on the supported boards without removing the case. Anti-slip rubber feet keep the unit stable on a bench, while the wall-mount compatible design lets you fix it to a vertical surface. The package includes thermal pads, screws and a screwdriver for immediate assembly.
Builders who need better thermal dissipation than a standard plastic enclosure will benefit from the aluminium construction and supplied heat sinks. It is not suited for Raspberry Pi 4 or later models, nor for projects requiring internal expansion headers that the precision cuts do not expose.
| Brand | Micro Connectors |
|---|---|
| Model | RAS-PCS03-SL |
| Features | Compatible with Raspberry Pi 1 Model B+, Pi 2 Model B, Pi 3 Model B/B+ Quality and durable aluminum casing to dissipate heat Precision-cut casing allows easy access to all ports Heat sink kits included for cooling Wall mount compatible Anti-slip rubber feet pads Dimension: 1.08" x 2.43" x 3.52" Weight: 0.12 lb. |
| Package Contents | Raspberry Pi case, heat sinks, feat pads, screws, screwdriver |
| Fraktvekt | 0.10 kg |
| Pakkestørrelse | 194 × 94 × 43 mm |
The aluminum casing is designed to dissipate heat from the board, and the included heat sinks attach directly to the main chips to move heat into the case body.
No fan is included or mentioned; cooling relies on the passive aluminum body and the supplied heat sinks, so operation is silent.
The case fits Raspberry Pi 1 Model B+, Pi 2 Model B, and Pi 3 Model B or B+ boards.
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