Noctua NT-H2 3.5g thermal paste with cleaning wipes

Premium thermal compound for CPU and GPU

Noctua NT-H2 is a second-generation hybrid paste formulated with micro-particles to improve heat transfer from the processor or graphics chip to the cooler. The 3.5 g syringe contains enough material for roughly three to twenty applications depending on die size. It is non-conductive and non-corrosive, removing the risk of short circuits on any heatsink type.

Upgrade path from older pastes

The compound replaces aged or basic thermal grease that has dried out or lacks the particle density to fill microscopic surface gaps. A switch is worthwhile when temperatures under load remain high despite adequate airflow or when a cooler is reseated after maintenance. The included NA-CW1 cleaning wipes simplify complete removal of the previous layer before fresh application.

Build integration and longevity

No spreading is required before mounting the heatsink; pressure during installation distributes the paste evenly across the die. The formula remains stable for up to five years on the CPU and can be stored for up to three years unopened. This frees the builder from frequent re-pasting cycles and suits both air and liquid cooling loops without specific clearance or power requirements.