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Green EEB server motherboard dual SP3 sockets sixteen DDR4 slots dual 10GbE RJ45 ports

ASRock Rack

ASRock Rack ROME2D16-2T EEB server motherboard dual SP3 16 DIMM 2x10GbE

SKU CH-T095-EK85S MPN ROME2D16-2T

Dual-socket AMD EPYC server board with 16 DDR4 DIMM slots, five PCIe 4.0 x16 slots and dual 10GbE LAN

  • CPU Socket TypeSocket SP3
  • CPU TypeSupports AMD EPYC 7003 (with AMD 3D V-Cache Technology*) / 7
  • Number of Processor Support2
  • CPU FeaturesThermal Design Power 280 W
  • Number of DDR4 Slots8+8 DIMM slots (1DPC) DDR4 288-pin
  • DDR4 StandardRDIMM/ LRDIMM/NVDIMM-N: max. 3200MHz
  • Dual SP3 sockets scale compute with AMD EPYC 7002 and 7003 processors
  • Sixteen DDR4 DIMM slots support up to 256 GB per module for massive memory capacity
  • Five PCIe 4.0 x16 slots plus one x8 slot enable high-bandwidth expansion cards
  • Dual 10 GbE Intel X550-AT2 ports plus dedicated IPMI provide fast, managed networking
  • EEB 12" x 13" form factor fits standard server chassis for dense deployments

Dual-socket EPYC server board

The ASRock Rack ROME2D16-2T is an EEB form-factor motherboard built for dual AMD EPYC 7002 or 7003 series processors in SP3 sockets. It provides sixteen DDR4 DIMM slots across two CPU channels, supporting registered RDIMM, LRDIMM and NVDIMM-N modules up to 256 GB per slot. Five PCIe 4.0 x16 slots and one x8 slot offer high-bandwidth expansion for compute or storage accelerators.

Suited for dense compute and storage nodes

This board targets builders assembling high-core-count servers, virtualization hosts or storage appliances that need dual 10 GbE and extensive PCIe 4.0 lane count. It is not a fit for single-socket workstations, systems requiring consumer CPUs, or chassis limited to ATX or smaller form factors. Buyers needing integrated graphics beyond basic Aspeed AST2500 output should look elsewhere.

Sixteen DDR4 slots with 256 GB per DIMM ceiling

The defining specification is the sixteen-slot memory subsystem, accepting DDR4 RDIMM up to 64 GB, LRDIMM up to 128 GB and 3DS modules up to 256 GB each. This capacity ceiling decides whether the platform can meet a given workload's memory footprint before any other feature is considered.

Fordele

  • Dual SP3 sockets scale compute with AMD EPYC 7002 and 7003 processors
  • Sixteen DDR4 DIMM slots support up to 256 GB per module for massive memory capacity
  • Five PCIe 4.0 x16 slots plus one x8 slot enable high-bandwidth expansion cards
  • Dual 10 GbE Intel X550-AT2 ports plus dedicated IPMI provide fast, managed networking
  • EEB 12" x 13" form factor fits standard server chassis for dense deployments

Specifikationer

BrandAsRock Rack
ModelROME2D16-2T
CPU Socket TypeSocket SP3
CPU TypeSupports AMD EPYC 7003 (with AMD 3D V-Cache Technology*) / 7002 Series Processors
*A BIOS update is required to support AMD EPYC 7003 series processors with AMD 3D V-Cache Technology
Number of Processor Support2
CPU FeaturesThermal Design Power 280 W
Number of DDR4 Slots8+8 DIMM slots (1DPC) DDR4 288-pin
DDR4 StandardRDIMM/ LRDIMM/NVDIMM-N: max. 3200MHz
Maximum Memory SupportedMax. Capacity per DIMM
- RDIMM: up to 64GB
- LRDIMM: up to 128GB
- RDIMM/LRDIMM-3DS: up to 256GB
- NVDIMM-N: up to 32GB
RegisteredYes
PCI Express 4.0 x16Slot 6: PCIe x16 (PCIe 4.0 x16) [CPU1]
Slot 5: PCIe x16 (PCIe 4.0 x16) [CPU0]
Slot 4: PCIe x16 (PCIe 4.0 x16) [CPU1]
Slot 3: PCIe x16 (PCIe 4.0 x16) [CPU0]
Slot 1: PCIe x16 (PCIe 4.0 x16) [CPU0]
(SLOT7 close to CPU)
PCI Express x8Slot 2: PCIe x8 (PCIe 4.0 x8) [CPU1]
Other Slots2 low-profile SlimSAS (PCIe4.0 x8 or 8 SATA 6Gb/s) [CPU0, CPU1]*
*Low-profile SlimSAS from CPU0 support PCIe only while installing 2 processors
2 Oculink (PCIe4.0 x4 or 4 SATA 6Gb/s) [CPU0,CPU1]
M.21 x M-key (PCIe4.0 x4 or SATA 6Gb/s), supports 22110/2280/2242 form factor [CPU0]
1 x M-key (PCIe4.0 x4), supports 22110/2280/2242 form factor [CPU0]
Onboard Video ChipsetAspeed AST2500
LAN ChipsetIntel X550-AT2
LAN Speed10Gbps
Max LAN Speed2 x 10Gbps
Back I/O PortsVGA Port: 1 DB15 (VGA)
USB 3.2 Gen1 Port: 2 Type-A (USB3.2 Gen1)
RJ45: 2 RJ45 (10GbE), 1 dedicated IPMI
Onboard USBUSB 3.2 (Gen1) Header: 2 via 19-pin header
Other ConnectorsCOM Header: 1
Auxiliary Panel Header: 1 (18-pin): chassis intrusion, system fault LED, LAN1/LAN2 activity LED, locate, SMBus
TPM Header: 1 (17-pin, LPC), 1 (13-pin, SPI)
IPMB Header: 1
VGA Header: 1
PMBus CONN: 1
Fan Header: 8 (6-pin)
NMI Header: 1
System Panel: 1 (9-pin): power switch, reset switch, system power LED, HDD activity LED
BMC_SMB Header: 2
SGPIO Header: 4
CPU HSBP: 1
Power Connector: 1 (24-pin, ATX main power), 3 (8-pin, ATX 12V)
Clear CMOS: contact pads
Form FactorEEB
Dimensions (W x L)12" x 13"
Forsendelsesvægt2.32 kg
Pakkestørrelse382 × 360 × 67 mm

Spørgsmål om denne vare

What EEB chassis dimensions and mounting pattern does the ROME2D16-2T require?

The board follows the EEB 12" x 13" form factor, so the chassis must accept that footprint and the standard EEB mounting holes.

Which BIOS version must be flashed before installing an EPYC 7003 processor with 3D V-Cache, and how is it applied?

A BIOS update is required for EPYC 7003 series processors with AMD 3D V-Cache Technology; apply it via the dedicated IPMI port or the BMC web interface before seating the CPUs.

What is the maximum capacity per DIMM slot for RDIMM, LRDIMM and 3DS modules on this board?

Each of the 16 DDR4 slots supports up to 64 GB RDIMM, 128 GB LRDIMM or 256 GB 3DS RDIMM/LRDIMM modules.

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