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Small grey syringe of Bitspower thermal paste 5g

Bitspower

Bitspower BPA-TP1-5G thermal paste 5g

SKU CH-VYZH-NFHMR

Non-silicone thermal compound with 6.5 W/m-K conductivity, 0.009 K-in²/W impedance, easy application and no burn-in required

  • TypeCPU Block
  • Low thermal impedance of 0.009 K-in²/W for efficient heat transfer
  • High thermal conductivity of 6.5 W/m-K improves cooling performance
  • Non-corrosive and non-conductive formula protects components
  • Easy application with low dry-out for long-term stability
  • No burn-in time required and minimal storage needs

Bitspower BPA-TP1-5G thermal paste 5g

This non-silicone thermal compound delivers a thermal conductivity of 6.5 W/m-K and a thermal impedance of 0.009 K-in2/W. It is non-corrosive and non-electrically conductive for safe application on CPUs and GPUs. The grey grease offers excellent long-term stability with low dry-out characteristics. No burn-in time is required after installation.

Fits standard CPU and GPU mounting setups

The paste spreads easily and evenly during installation, requiring only a relatively small amount per application. Its viscosity is rated below 600,000 CPS for consistent coverage. No special storage conditions are needed to maintain the compound's properties over time. The dielectric strength is rated at 0.9 KV/mm for electrical insulation.

Suits builders seeking reliable thermal transfer

The 5-gram syringe covers a limited number of applications, so users planning multiple system builds may need additional units. The specific gravity of 2.5 g/cm3 indicates a dense compound optimised for thin bond lines. Buyers requiring electrically conductive paste or higher volume packaging should consider alternative products.

Fordele

  • Low thermal impedance of 0.009 K-in²/W for efficient heat transfer
  • High thermal conductivity of 6.5 W/m-K improves cooling performance
  • Non-corrosive and non-conductive formula protects components
  • Easy application with low dry-out for long-term stability
  • No burn-in time required and minimal storage needs

Specifikationer

BrandBitspower
ModelBPA-TP1-5G
TypeCPU Block

Spørgsmål om denne vare

How much thermal impedance does the 6.5 W/m-K paste add under sustained load?

The compound specifies a thermal impedance of 0.009 K-in2/W, so sustained use adds minimal resistance between the die and cold plate.

Does the gray non-silicone grease dry out or become noisy when the system runs all day?

Low dry-out and non-corrosive formulation keep the interface stable without pump-out, so temperatures and fan noise stay consistent during continuous operation.

What existing cooler mounting hardware is required to use this 5 g syringe?

Any standard CPU block or air cooler that accepts manual paste application will work; the compound itself needs no special brackets or tools.

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