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Silver 2U rack server front with eight 2.5-inch drive bays and DVD slot

DELL

DELL PowerEdge R730 2U rack server E5-2609 v3 1.9GHz 16GB DDR4 H330

SKU CH-1N17-VM0CY

2U rack server with a six-core Xeon E5-2609 v3 at 1.9 GHz, 16 GB DDR4, H330 RAID controller and eight 2.5-inch hot-plug bays

  • TypeRack
  • Rack Height2U
  • Redundant Hot-swap PowerYes
  • CPU TypeIntel Xeon
  • MAX Processors2
  • ChipsetIntel C610

Installed Memory Size 16GB

HDD None

  • Six-core Xeon E5-2609 v3 at 1.9 GHz handles parallel workloads
  • 16 GB DDR4 memory supports virtualization and database tasks
  • H330 12 Gbps RAID controller enables RAID 0, 1, 5, 10, 50, 60
  • Dual 750 W redundant power supplies keep the server running during a failure
  • 2U rack chassis with eight 2.5" hot-plug bays fits dense data-centre rows

Server identity and target role

This 2U rack server is built around a single Intel Xeon E5-2609 v3 six-core processor running at 1.9GHz with 16GB of DDR4 memory. It suits small-business virtualization hosts, internal application servers or development environments that need redundant power and hot-plug drive bays without a full dual-socket investment.

Bundled controller and expansion

The Dell PERC H330 12Gbps RAID controller supports RAID 0, 1, 5, 10, 50 and 60 across up to eight 2.5-inch hot-plug SAS or SATA bays. Two 750W redundant power supplies, a DVD-ROM drive and an iDRAC8 Express remote-management module are included; rails, bezel and peripherals are not.

Capacity limits and headroom

Memory tops out at 16GB installed with 24 DIMM slots available for future upgrades to 1536GB using DDR4 modules up to 2400MT/s. Storage scales to 64TB across the eight bays, while seven PCIe 3.0 slots plus a dedicated PERC slot provide room for additional networking or acceleration cards.

Fordele

  • Six-core Xeon E5-2609 v3 at 1.9 GHz handles parallel workloads
  • 16 GB DDR4 memory supports virtualization and database tasks
  • H330 12 Gbps RAID controller enables RAID 0, 1, 5, 10, 50, 60
  • Dual 750 W redundant power supplies keep the server running during a failure
  • 2U rack chassis with eight 2.5" hot-plug bays fits dense data-centre rows

Specifikationer

BrandDELL
SeriesPowerEdge
ModelPowerEdge R730
TypeRack
Rack Height2U
Redundant Hot-swap PowerYes
CPU TypeIntel Xeon
MAX Processors2
ChipsetIntel C610
Installed Memory Size16GB
Memory TypeDDR4
Max Memory Capacity16GB
Memory Features24 DIMM slots, 12 per processor. (4GB/8GB/16GB/32GB/64GB/128GB DDR4 up to 2400MT/s, actual memory speed dependent on the processor capability)
Number of Memory Slots24
Storage ControllerDell Perc H330 Controller
SSD (Installed)No
Raid LevelRAID 0/1/5/10/50/60
Max HDD Capacity64TB
Media DrivesDVD ROM
GPU TypeMatrox G200
Video Memory8MB
Remote ManagementiDRAC8 with Lifecycle Controller, iDRAC8 Express (default), iDRAC8 Enterprise (upgrade) 8GB vFlash media (upgrade), 16GB vFlash media (upgrade)
LAN Ports4 x Ports
Expansion SlotsUp to 7 x PCIe 3.0 plus dedicated PERC slot
Operating SystemNo
Compatible/Certified OSMicrosoft Windows Small Business Server 2011/2008, Microsoft Windows Server 2008 R2 SP1/SP2, Microsoft Windows HPC Server 2008 R2, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux, Oracle Solaris
Weight70.0000LBS

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Spørgsmål om denne vare

How many DDR4 DIMM slots are free for future memory upgrades on the PowerEdge R730?

The server has 24 DDR4 DIMM slots in total, with 12 slots per processor. Since one processor is installed, 12 slots are available for additional DDR4 modules up to 128GB each.

Which component reaches its limit first when the H330 controller runs sustained RAID 5 or 6 workloads?

The H330 12Gbps RAID controller manages the array, so its processing throughput and cache become the bottleneck before the 2.5-inch SAS or SATA drive interfaces saturate.

What is the typical power draw and heat output when both 750W redundant supplies run the R730 continuously?

Dual 750W redundant power supplies share the load, drawing only what the E5-2609 v3 CPU, 16GB DDR4, H330 controller and up to eight drives require, keeping heat proportional to actual component demand.

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