JunPus International Co., Ltd.
JunPus Nano Diamond Thermal Grease JP-DX1 3.0g 16 w/mk
Nano-diamond thermal paste rated at 16 W/m·K for CPUs and GPUs, stable from -45 °C to 200 °C and supplied with an applicator blade
- Volume / Net Weight3.0g
- Thermal Conductivity16 w/mk
- Long Term Operating Temperature-45 to 200 C
- SpecificationsThermal compound
- Featureshigh Thermal Conductivity
- High conductivity at 16 w/mk for efficient heat transfer
- Low thermal impedance of 0.05 cm²/W reduces resistance
- Non-curing formula stays workable up to 4 years on CPU
- Wide operating range from -50 °C to 250 °C peak
- Easy application with included razor blade for precise spreading
JunPus Nano Diamond Thermal Grease JP-DX1 3.0g
JunPus Nano Diamond Thermal Grease JP-DX1 is a high-performance thermal compound designed for PC builders and overclockers seeking efficient heat transfer between a CPU or GPU and its cooler. The 3.0g syringe provides enough material for multiple applications on standard desktop processors. Its non-corrosive and non-toxic formula ensures safe handling and long-term reliability on sensitive components.
16 w/mk conductivity and thermal headroom
With a thermal conductivity of 16 w/mk and thermal impedance of .05 cm²/W, this paste comfortably handles high heat loads from overclocked CPUs and GPUs. The recommended operating range spans -40°C to +240°C, while peak tolerance reaches -50°C to +250°C, offering wide headroom for extreme cooling scenarios. It runs out of effectiveness only when pushed beyond these temperature limits or after the recommended four-year usage period on the die.
Non-curing formula with included applicator
The nano diamond particle structure prevents curing and solidification over time, maintaining consistent performance for up to four years on the CPU and three years in storage. An included razor blade simplifies precise, bubble-free spreading across the integrated heat spreader. The gray, non-flammable compound with 2.7 g/cm³ specific gravity cleans easily without leaving corrosive residue, simplifying future maintenance or cooler swaps.
Fordele
- High conductivity at 16 w/mk for efficient heat transfer
- Low thermal impedance of 0.05 cm²/W reduces resistance
- Non-curing formula stays workable up to 4 years on CPU
- Wide operating range from -50 °C to 250 °C peak
- Easy application with included razor blade for precise spreading
Specifikationer
| Brand | Junpus |
|---|---|
| Series | JP-DX1 |
| Model | JP-DX1 |
| Volume / Net Weight | 3.0g |
| Thermal Conductivity | 16 w/mk |
| Long Term Operating Temperature | -45 to 200 C |
| Specifications | Thermal compound |
| Features | high Thermal Conductivity |
Spørgsmål om denne vare
Will the 16 w/mk thermal conductivity of this paste work effectively with an older CPU cooler that has a rougher base surface?
The 16 w/mk conductivity and low 0.05 cm²/W thermal impedance help fill microscopic gaps on older cooler bases, improving heat transfer even with less-than-perfect surface flatness.
How can I verify the JP-DX1 is performing correctly after applying it to my CPU?
Monitor CPU temperatures under load; they should stabilise within the recommended operating range of -40°C to +240°C, indicating the paste is conducting heat efficiently without curing or drying out.
Does the 3.0g syringe include the razor blade applicator mentioned in the features, or must I buy a spreading tool separately?
The package includes a razor blade for easy application, so no separate spreading tool is required; the 3.0g volume is sufficient for multiple standard CPU installations.
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